Matsushita Electric Industrial Co., Ltd.

Matsushita Electronics Corporation

Osamu Adachi

Masanori Minamio

Osamu Konosu

Toru Nomura

Shigeya Ashizaki

Takashi Inoue

Hiroyuki Nagano

Shuji Ueda

Hiromi Wakasono

Kakuichiro Hosokoshi

Shohroh Mochida

Yasunori Miura

Kazuo Ueno

Itsuro Komori

Toshiaki Katano

A terminal land frame includes a frame body and a plurality of lands. Each of these lands is formed out of the frame body to be connected to the frame body via a thinned portion and protrude therefrom. When the lands are pressed in a direction in which the lands protrude from the frame body, the thinned portions are fractured and the lands are easily separable from the frame body. A semiconductor chip is mounted on some of the lands of the terminal land frame, and the chip, wires, etc. are single-side-molded with a resin encapsulant. Thereafter, when the lands are pressed on the bottom, the lands are separated from the frame body. As a result, a structure, in which the lower part of each of these lands protrudes downward from the lower surface of the resin encapsulant, is obtained, and protruding portion is used as an external electrode.

Terminal land frame and method for manufacturing the same

In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is inclined at a predetermined angle and the bottom of the land portion is made lower than that of a lead. Thus, in a resin molding process using a seal sheet, the land electrode is forced into, and strongly adhered to, the seal sheet when pressure is applied through dies, and no resin encapsulant reaches the land electrode. As a result, no resin bur will be left on the land electrode of the land lead.

Resin-molded semiconductor device

A terminal land frame includes a frame body and a plurality of lands. Each of these lands is formed out of the frame body to be connected to the frame body via a thinned portion and protrude therefrom. When the lands are pressed in a direction in which the lands protrude from the frame body, the thinned portions are fractured and the lands are easily separable from the frame body. A semiconductor chip is mounted on some of the lands of the terminal land frame, and the chip, wires and so on, are single-side-molded with a resin encapsulant. Thereafter, when the lands are pressed on the bottom, the lands are separated from the frame body. As a result, a structure, in which the lower part of each of these lands protrudes downward from the lower surface of the resin encapsulant, is obtained, and that protruding portion is used as an external electrode. In this manner, a downsized and thinned resin-molded semiconductor device is provided at a lower cost and with higher reliability.

Leadframe for a semiconductor device having leads with land electrodes

Leadframe and method for manufacturing resin-molded semiconductor device

The present invention relates to a color cathode ray tube that reduces a leakage electric field and a maximum instantaneous current generated in a bulb at the time of electric discharge and provides a stable connection of conductive layers with different specific resistance. A first conductive layer is formed on the entire area of an inner wall of a funnel including a contact portion of a first spring supported by a shadow mask structure, an anode button and a contact portion of a second spring supported by a final electrode of an electron gun. A second conductive layer with a specific resistance lower than that of the first conductive layer is formed on the surface of the first conductive layer within the range extending from the anode button to the contact portion of the first spring. The contact portion of the first spring contacts the second conductive layer, thereby electrically connecting the shadow mask structure to the second conductive layer, and the contact portion of the second spring contacts the first conductive layer, thereby electrically connecting the final electrode to the first conductive layer.

Color cathode ray tube moving two inner conductive layer with different resistance

Light radiated from a light source is gathered by an oval mirror. The gathered light is incident on one end of a rod-shaped optical integrator, integrated and made uniform within the optical integrator, and is radiated from the other end of the optical integrator. The light from the optical integrator is diffused and projected on an exposure area of a display tube by a lens system. The lens system presents an astigmatism, thereby forming a first virtual focus and a second virtual focus on its virtual image area. The diffused light is apparently diffused vertically at the first virtual focus and apparently diffused horizontally at the second virtual focus. The first vertical focus and the second vertical focus correspond respectively in position to the positions of the vertical deflection means and horizontal deflection means of the display tube. Therefore, the directions of the exposure light beams which shed light on green, blue, and red dots are in agreement with the directions of the deflected electron beams. As a result, the deflected electron beams can sweep over the green, blue, and red dots accurately in synchronization with image signals.

Exposure equipment for display tube fabrication

A shadow mask type color cathode ray tube which has a face panel whose screen face is flattened to more than two times the flatness of the conventional flat panels without reducing the resistance of the glass bulb to outside pressure in spite of its relatively thin glass wall, and has an enhanced reflection characteristic of incident light as well as improved local doming characteristics.

Shadow mask type color cathode ray tube

A color picture tube includes a rectangular shadow mask having a longer axis and a shorter axis. The shadow mask has a curved surface. A point of the curved surface of the shadow mask is represented by an orthogonal coordinate system having an X component, a Y component, and a Z component. The coordinate system has an origin coincident with a center of the curved surface. The X component is measured along the longer axis. The Y component is measured along the shorter axis. The Z component is measured in a direction perpendicular to directions of the longer and shorter axes. A sagittal height of the curved surface represented by the Z component and measured from the origin is given by a polynomial including a term of a sixth-degree power of one of the X component and the Y component.

Color picture tube having reduced local doming

In a color picture tube, curvature of outside face of said face panel is defined by ##EQU1## wherein Z is a distance in a direction of tube axis from an X-Y plane tangential at the center of the face, r is a distance from the center of the face panel to said point therealong, and A and B are constants of positive integers, respectively; thus the face panel excludes point of inflection and the reproduced picture thereon has a flat appearance, without trouble of undesirable doming of shadow mask.

Growing community of inventors

Kyoto, Japan

Osamu Adachi