Shin-etsu Polymer Co., Ltd.

Osami Hayashi

Akio Nakamura

Hirofumi Saita

Naoki Kodama

Katsuhisa Aizawa

Hideki Tabei

Yasuhiro Goto

The inventive interconnector, which is used for electrically connecting two arrays of electrodes on two circuit boards, etc., is a striped sheet composed of alternately arranged strips of an insulating adhesive hot-melt resin and strips of a conductive adhesive hot-melt resin composition. The interconnector is prepared by stacking a film of the insulating resin coated on one surface with the conductive composition, integrating the stack into an integral block and slicing the block in a plane perpendicular to the surface of the stacked films. Alternatively, the interconnector is composed of a matrix of an insulating adhesive hot-melt resin and regularly distributed spots of a conductive adhesive hot-melt resin composition. Such an interconnector can be prepared by stacking alternately numbers of the above mentioned striped sheets and sheets of the insulating adhesive hot-melt resin one on the other, integrating the stack into an integral block and slicing the block in a plane perpendicular to the running direction of the conductive strips in the conductive sheets.

Method for the preparation of a hot-melt adhesive interconnector

The invention provides an efficient method for the preparation of a plastic-made computer-operating card having an emboss-worked relief pattern on the surface by adhesively bonding an emboss-worked plastic-made covering sheet to a body of the card. In the inventive method, a sheet for covering is lined with a second sheet on the back surface and the laminate is emboss-worked so that the debris of the second sheet fills up the cavity formed behind the relief pattern in the first sheet followed by peeling off the undeformed portion of the second sheet leaving the debris filling the cavity. Since the cavity behind the emboss-worked relief pattern is filled up with the debris of the second sheet, the emboss-worked covering sheet is safe from the troubles of collapsing or flattening in the subsequent step of adhesive bonding thereof to the body of the card.

Method for the preparation of an emboss-worked plastic card

The invention provides a very efficient and reliable method for electrically connecting the electrodes of an electronic device, e.g., IC chips, and the electrodes of, for example, a glass-made circuit board substrate with good repairability. Thus, the electrodes of the IC chip are each first coated with an electroconductive thermally meltable adhesive resinous composition to form a resinous bump, the IC chip is mounted on the substrate with the adhesive-coated electrodes contacting with the respective electrodes of the substrate, and remelting and then solidifying the resinous bumps so that the electrodes are bonded and electrically connected together. As compared with the conventional methods in which an electroconductive thermosetting resinous composition is used for the bumps on the electrodes, the electrical connection can be obtained with a smaller thermal effect and good replaceability of the IC chip found unacceptable with an acceptable one.

Method for electrically connecting IC chips, a resinous bump-forming

The invention provides an electrothermal hot-melt type thermal transfer ink ribbon having a multi-layered structure used in thermal printers having a multi-stylus electrode head. Different from conventional ink ribbons of such a type composed of an electroconductive base film as a resistive layer, a vapor-deposited aluminum layer to serve as an electric pass to a return electrode and a layer of a hot-melt ink, the inventive ink ribbon has an additional layer as a heat barrier between the aluminum layer and the hot-melt ink layer so that the heat generated in the resistive base film and reaching the ink layer is radially diffused to produce a remarkable temperature gradient within the dot decreasing from the center to the periphery thus to provide a possibility of gradation control of the optical density of the printed dots by means of the voltage adjustment.

Growing community of inventors

Saitama, Japan

Osami Hayashi