Ferro Corporation

Orville Washington Brown

Srinivasan Sridharan

George E Sakoske

John J Maloney

Yie-Shein Her

Stanley Wang

George E Graddy, Jr

Ellen Schwartz Tormey

Walter J Symes, Jr

Jackie D Davis

Mohammed H Megherhi

Cody J Gleason

Gregory R Prinzbach

David L Widlewski

Thomas Joseph Coffey

Peter Marley

James E Henry

Walter Symes

Yie-Shen Her

A low K value, high Q value, low firing dielectric material and method of forming a fired dielectric material. The dielectric material can be fired below 950&#xb0; C. or below 1100&#xb0; C., has a K value of less than about 8 at 10-30 GHz and a Q value of greater than 500 or greater than 1000 at 10-30 GHz. The dielectric material includes, before firing a solids portion including 10-95 wt % or 10-99 wt % silica powder and 5-90 wt % or 1-90 wt % glass component. The glass component includes 50-90 mole % SiO, 5-35 mole % or 0.1-35 mole % BO, 0.1-10 mole % or 0.1-25 mole % AlO, 0.1-10 mole % KO, 0.1-10 mole % NaO, 0.1-20 mole % LiO, 0.1-30 mole % F. The total amount of LiO+NaO+KO is 0.1-30 mole % of the glass component. The silica powder can be amorphous or crystalline.

Low K dielectric compositions for high frequency applications

LTCC devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a matrix of titanates of alkaline earth metals, the matrix doped with at least one selected from rare-earth element, aluminum oxide, silicon oxide and bismuth oxide.

Mid-K LTCC compositions and devices

High thermal conductivity dielectric materials systems or pastes are useful on aluminum alloy substrates for LED and high power circuitry applications.

Dielectric pastes for aluminum substrates

Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.

Lead-free and cadmium-free conductive copper thick film pastes

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Carlsbad, CA, United States of America

Orville Washington Brown