Nvidia Corporation

Stats Chippac Pte. Ltd.

Orion K Starr

Rajendra D Pendse

Marcos Karnezos

Inderjit Singh

Koo Hong Lee

Behdad Jafari

Kyung-Moon Kim

Ray Chen

Moon Hee Lee

An integrated circuit/substrate interconnect apparatus and method are provided. Included is an integrated circuit including a plurality of bond pads, and a substrate including a plurality of landing pads and a mask. Such mask is spaced from the landing pads for defining areas therebetween. Further provided is a plurality of interconnects connected between the bond pads of the integrated circuit and the landing pads of the substrate. The interconnects include metal projections extending from the bond pads and a solder material for connecting the metal projections and the landing pads of the substrate.

Integrated circuit/substrate interconnect system and method of manufacture

Methods for forming flip chip interconnection, in which the bump interconnect is defined at least in part by an underfill. The underfill includes a material that is thermally cured; that is, raising the temperature of the underfill material can result in progressive curing of the underfill through stages including a gel stage and a fully cured stage. According to the invention, during at least an early stage in the process the semiconductor chip is carried by a thermode, which is employed to control the temperature of the assembly in a specified way. Also, flip chip interconnections and flip chip packages made according to the methods of invention.

Flip chip interconnection

Growing community of inventors

San Jose, CA, United States of America

Orion K Starr