The Perkin-elmer Corporation

Svg Lithography Systems, Inc.

Laganza, Joseph L.

Engelbrecht, Orest

Orest Engelbrecht

Joseph L Laganza

David A Markle

This invention relates to apparatus for prealigning the transport stage of an automated wafer handling lithographic system. The wafer is first rotated and its displacement in X, Y, and .THETA. from a desired orientation is determined. The wafer chuck of the transport stage is then displaced by a compensating amount.

Wafer handling system

This invention relates to a method and apparatus for prealigning the transport stage of an automated wafer handling lithographic system. The wafer is first rotated and its displacement in X, Y, and .THETA. from a desired orientation is determined. The wafer chuck of the transport stage is then displaced by a compensating amount.

A reticle frame for precisely holding a reticle or mask used in photolithography with a minimum of distortion. A plurality of adjusting screws are used to accurately position the reticle within the frame. Transversely compliant axial loading springs opposing the adjusting screws reduce the bending forces acting on the reticle. Precision balls are used to establish a plane for the reticle further reducing bending forces thereon causing less distortion and thereby proving greater resolution when the reticle image is reproduced on a semiconductor wafer.

Reticle frame assembly

This invention relates to apparatus for pre-aligning the transport stage of an automated wafer handling lithographic system. The wafer is first rotated and its displacement in X, Y, and .theta. from a desired orientation is determined. The wafer chuck of the transport stage is then displaced by a compensating amount.

Apparatus is set forth for prealigning the transport stage of an automated wafer handling lithographic system. The wafer is first rotated and its displacement in X, Y, and .THETA. from a desired orientation is determined. Rotation of the wafer is stopped when its angular position reaches a desired orientation. The wafer chuck of the transport stage is then displaced to compensate for any deviation of the wafer in the X and Y directions from a desired rectilinear orientation. This permits the wafer stage to present the wafer to the exposure station of a lithographic system aligned in the X, Y and .theta. directions.

The described invention is a precisely adjustable transporter for moving a reticle past an optical slit as a step in the production of semiconductor wafers. The reticle stage rides along a pair of optically flat planar, intersecting, bearing surfaces supported by air bearings on each bearing surface. Pressurized air and vacuum may be simultaneously employed to effect substantially friction-free motion while preventing displacement from the bearing surfaces. Axial adjustments on each air bearing permit precise adjustment of the reticle stage and reticle.

Reticle transporter

A wafer chuck assembly having an elevator for accepting a wafer and placing it precisely on a platen without changing its spatial orientation.

Wafer transferring chuck assembly

In a ring field projection optical system for imaging a mask on a wafer the illumination source has readily adjustable means for obtaining uniform exposure along the length of the arcuate zone of illumination.

Growing community of inventors

Ridgefield, CT, United States of America

Orest Engelbrecht