International Business Machines Corporation

Advanced Micro Devices Corporation

Ooi Tong Ong

Mark T Lam

Raj N Master

Mohammad Zubair Khan

Maria G Guardado

The embodiments described herein relate to methods, systems, and computer program products for improving the product quality of product lots produced on a production line. A quality value for each product lot is determined, and a quality benchmark is established. Each product lot is classified based on the quality benchmark. Product lots that have a quality value meeting the quality benchmark are classified as quality lots, and product lots having a quality value failing to meet the quality benchmark are classified as failing lots. Tools used in the production of the product lots are identified, which includes identifying a set of quality tools and a set of failing tools. Routing of additional product lots is directed by shifting production at least substantially to the set of quality tools.

Production line quality processes

Methods, systems, and software for improving the product quality of a production line having multiple production steps, at least some of which employ multiple individual tools, including producing product lots using different combinations of tools, setting a quality benchmark for the resulting product lots, identifying product lots that meet the quality benchmark, identifying the tools used to produce the identified quality product lots, and producing additional product lots using at least substantially the identified quality tools.

A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

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Singapore, Singapore

Ooi Tong Ong