International Business Machines Corporation

Omkarnath R Gupta

Robert E Simons

Richard C Chu

Layton Balliet

Stephen B Greenspan

Un-Pah Hwang

Albert L Torino

Allan S Cole

Alvin H Bauman, Jr

A compact low-cost drive for a robotic gripper system is disclosed having a rotationally driven shaft connected to an energy source for transmitting energy provided by the energy source to the gripper. An epicyclic gear arrangement is coupled to the shaft to convert the rotational motion of the shaft into a linear motion. At least one of the pins connected to the gears is linearly translateable in two directions under the control of the energy source. Fingers are recessed in the pins to facilitate gripping and releasing objects to be handled by the gripper system. A feedback means coupled between the energy source and the fingers can also be used to sense and control the position of the fingers.

Robotic gripper drive system

A cooling system is described for modules on electronic circuit cards, the system typically containing a multiplicity of cards. Improved cooling is achieved due to improved boundary layer conditions established by counter air flow in opposite directions on opposite sides of the cards.

Cooling system with counter flow of coolant

An optical fiber connector is provided having identical connector halves including mating surfaces which are made of a soft metal and the surface configuration is coined or stamped therein by the same die to provide minimum manufacturing tolerance errors between fiber holding rails located in a channel on each surface. Locating holes and projections are likewise located in said mating surfaces so that, when one surface is reversed with respect to the other and mated thereto, the optical fibers placed between the rails and precisely cut with respect to a limit line will mate end to end coaxially with the end surfaces in the same plane.

Optical fiber connector

A multi-chip module is provided having one or more cylinders formed in the module cap, each centered over the middle chip of a group of chips. Cooling fins are attached to and extend from each of the cylinders. A heat conductive piston is located in each of the cylinders forming a small interface between the piston and the cylinders and the piston and the middle chip. The heat conductive piston is spring loaded against the chips. A heat conductive conformal surface flange extends radially from the outer end of each of the pistons so as to have portions thereof contacting adjacent chips in the group of chips, thereby providing parallel conduction cooling from the adjacent chips to the central heat conductive piston. Heat conductive spring means are included between the module caps and the flange for providing a seating force of the flange against the chips and providing an additional heat transfer path from the chip.

Air cooled multi-chip module having a heat conductive piston spring

The thermal conduction module for removing heat from one or more chips located therein consists of a housing made of heat conductive materials forming a cap over the chips. The housing contains one or more openings, one opposite each of the chips. More than one heat conductive element is included in each of the openings and are free to move lengthwise within the opening. The heat conductive elements are spring loaded so that the end of each element contacts the associated chip thereby lowering the thermal resistance of the interface therebetween. Side spring means are located between the sides of adjacent heat conductive elements forcing them away from one another and into contact with the opening wall.

Multi-stud thermal conduction module

A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains elongated openings therein extending towards the heat generating components and on the same centers with respect thereto. A resilient member is located in the cap in communion with the inner end of the openings. A thermal conductive element is located in each of the openings forming a small peripheral gap between each opening wall and the associated thermal conductive element. The resilient member urges the thermal conductive elements into pressure contact with the heat generating components. A thermal conductive inert gas is located within the cap filling the peripheral gaps and the interfaces between the heat generating elements and the thermal conductive elements. The heat is removed from the cap by external heat removal means.

Growing community of inventors

Boca Raton, FL, United States of America

Omkarnath R Gupta