Microelectronics and Computer Technology Corporation

Omkarnath R Gupta

Dennis J Herrell

Richard D Nelson

Claude Hilbert

David A Gibson

Thomas P Dolbear

An article provides sealing of an electronic component connected to a mating fluid heat exchanger by providing a diaphragm with an opening shaped to fit about the heat exchanger, the opening forming a sealing lip. A clamping ring, which expands and contracts as a function of temperature is placed around the lip of the diaphragm and subject to a temperature to shrink the clamping ring against the lip and heat exchanger for sealing the diaphragm thereto. Preferably the clamping ring is a shape memory alloy metal. In addition, a compressible metal seal may be placed between the lip and the heat exchanger to increase the ability to seal.

Diaphragm sealing apparatus

A thermally conductive coiled spring laid on its side provides a compliant, high conductive, low force thermal path between a heat source and a heat sink. Each spring contact provides two parallel heat conduction paths via each coil in the spring. The spring can be canted to permit slidable contact with a surface. In one embodiment a plurality of copper springs arranged in parallel can provide a thermal path between an electronic component and a heat sink in close proximity. The springs may be permanently attached to at least one surface at the points of contact.

Coiled spring heat transfer element

A high performance fluid heat exchanger for cooling an electronic component which includes a housing having a base, a plurality of parallel fins in the housing, a center fed inlet connected to the housing opposite the base for supplying cooling fluid towards the base and toward the ends of the fins. A plate is positioned between the tops and bottoms of the fins and extends generally parallel to the base and extends towards but is spaced from the ends of the fins for providing a double cooling pass against the fins.

Fluid heat exchanger for an electronic component

A high performance fluid heat exchanger for cooling an electronic component which includes a housing having a base heat transfer member, a plurality of parallel fins in the housing and center fed concentric inlet and outlet tubes connected to the housing opposite the base for supplying cooling fluid towards the base and to the ends of the fins.

A body having a bottom and first and second ends and a cavity therein. A plurality of substantially parallel spaced fins are positioned in the cavity. A liquid inlet is centrally positioned in the first end of the body and a liquid outlet is centrally positioned in the second end of the body where flowing cooling liquid between the fins from the first end to the second end with higher fluid flow between the fins in the center for preferentially cooling the center of the heat exchanger. A cross-sectional area of the liquid path in the body minimizes pressure drops and avoids abrupt direction changes and cross-sectional changes. The width, height and spacing of the fins may be varied to control the temperature of the areas in the bottom.

End fed liquid heat exchanger for an electronic component

A fluid heat exchanger for mating with an electronic component is supported from a fixed support. A connection between the fixed support and the heat exchanger is initially flexible for adjusting the position of the heat exchanger to accommodate variations in the height or attitude of the electronic component for providing a good thermal interface. Thereafter, the connection changes to a rigid connection to provide good structural suppport for the heat exchanger which allows the support to withstand vibration or shock without overloading the electronic component. The flexibility of the connection may be reversible for later readjusting the position of the heat exchanger relative to the electronic component.

Method and apparatus for adjustably mounting a heat exchanger for an

A high density, high performance and high fidelity connector system that can connect between electronic circuit planes having different wiring densities. The connector has a modular structure that avoids tolerance build-up for large (long) connections between two substrates, or between a substrate and a board. The connector design can accommodate differential temperature coefficients of expansion between the connector materials and the materials of the substrates being connected. The connector can be formed from low cost printed circuit board technology, or its equivalent, and can be configured to have controlled impedance, low crosstalk and wide bandwidth. The angle between surfaces being interconnected can vary from 0 to 360 degrees.

Printed wire connector

A plurality of thin flat parallel positioned thermal conductive fins adapted to be connected to an object and a gas passageway passing between adjacent fins and extending between the top of the fins and opposite sides. Gas guides are positioned between adjacent fins at the center of the plurality of fins and redirect the outlet end of the passageways normal to the inlet ends of the passageways. Alternately positioned fins face in opposing directions. The fins may be integrally formed or individually formed. A thermal conductive base may be provided at the bottom of the plurality of fins for connection to an electronic package.

Method of making gas heat exchanger

A plurality of thin flat parallel positioned thermal conductive fins adapted to be connected to an object and a gas passageway passing between adjacent fins and extending between the top of the fins and opposite sides. Gas guides are positioned between adjacent fins at the center of the plurality of fins and redirect the outlet end of the pasageways normal to the inlet ends of the passageways. Alternately positioned fins face in opposing directions. The fins may be integrally formed or individually formed. A thermal conductive base may be provided at the bottom of the plurality of fins for connection to an electronic package.

Growing community of inventors

Englewood, CO, United States of America

Omkarnath R Gupta