Intel Corporation

Intel IP Corporation

Omer Asaf

Sidharth Dalmia

Ana M Yepes

Josef Hagn

Eyal Goldberger

Nir Weisman

Naftali Landsberg

Miroslav Baryakh

Stefano Pellerano

Menashe Soffer

Meir Gordon

Kameran Azadet

Shilpa Talwar

Hosein Nikopour

Bryan K Casper

Ofir Degani

Wook Bong Lee

Ashoke Ravi

Michael Genossar

Claudio Da Silva

Debabani Choudhury

Rotem Banin

Albert Molina

Georgios Yorgos Palaskas

Igal Kushnir

Duncan Kitchin

Saku Lahti

Oner Orhan

Emanuel Cohen

Mikko S Komulainen

Gadi Shor

Jayprakash Thakur

Eren Sasoglu

Arnaud Lucres Amadjikpe

Trang Thuy Thai

Kunal Datta

Run Levinger

Moshe Teplitsky

Chintan S Thakkar

Eshel Gordon

Erkan Alpman

Ron Pongratz

Nebil Tanzi

Raanan Sover

Baljit Singh

Tawfiq Musah

Peter Sagazio

Amit Freiman

Shmuel Ravid

Kaushik Dasgupta

Yossi Tsfati

Eran Gerson

Resti Montoya Moreno

Anandaroop Chakrabarti

Marian K Verhelst

Shuhei Yamada

Noam Kogan

Ra'anan Sover

Mikko M Lampinen

Lior Shakedd

Avi Tsarfati

Saeid Daneshgar Asl

Amr M Fahim

Shinwon Kang

Te Yu Kao

Stefano Brenna

Nathan G Narevsky

Anat Bazov

Simon Svendsen

Gregory Chance

Brandon Davis

Pouya Talebbeydokhti

Anand S Konanur

Harry G Skinner

Gregory W Chance

Pablo Herrero

Brandon R Davis

Richard S Perry

Manish A Hiranandani

Jonathan Jensen

Woorim Shin

Dan Ohev Zion

Mustafijur Rahman

Danniel Nahmanny

Yaniv Michaeli

Trang Thai

Jonathan C Jensen

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

Wireless communication technology, apparatuses, and methods

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

Antenna boards and communication devices

Some demonstrative aspects include radar apparatuses, devices, systems and methods. In one example, an apparatus may include a plurality of Transmit (Tx) chains to transmit radar Tx signals, and a plurality of Receive (Rx) chains to process radar Rx signals. For example, the radar Rx signals may be based on the radar Tx signals. The apparatus may be implemented, for example, as part of a radar device, for example, as part of a vehicle including the radar device. In other aspects, the apparatus may include any other additional or alternative elements and/or may be implemented as part of any other device.

Radar apparatus, system, and method

Aspects of the embodiments are directed to an on-chip loop antenna and methods of manufacturing the same. In some embodiments, the on-chip loop antenna is in an integrated circuit (IC) die. The IC die comprises metal loops substantially centered around a core region of the IC die in a metallization stack of the IC die, a dielectric between spaces of the metal loops, an electric circuit in the core region electrically connected to the metal loops with an interconnect, and a ground plane in the metallization stack electrically connected to the loops with a first plurality of vias and to the electric circuit with a second plurality of vias. The first plurality of vias is different from the second plurality of vias, and the electric circuit includes an inductor. In some embodiments, the on-chip loop antenna can be carried by a semiconductor package.

Differential on-chip loop antenna

Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.

Perpendicular end fire antennas

Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.

Package on antenna package

Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.

Hybrid and thinned millimeter-wave antenna solutions

Aspects of the embodiments are directed to an on-chip loop antenna and methods of manufacturing the same. The on-chip loop antenna can be carried by a semiconductor package. The semiconductor package can include a printed circuit board coupled to an integrated circuit chip. The integrated circuit chip can include a semiconductor substrate, an integrated circuit; and a loop antenna surrounding the integrated circuit. In embodiments, the semiconductor package can include a metal shield enclosing the integrated circuit chip. In embodiments, the on-chip loop antenna can be impedance matched to the impedance of the integrated circuit. In embodiments, the integrated circuit can include an antenna driver to drive the antenna differentially, the on-chip loop antenna surrounding the antenna driver.

A metal chassis for a mobile device is configured to transmit a signal of a wavelength. A first side of the chassis faces the inside of the mobile device and includes a first aperture that has a dimension that comprises a first subwavelength width of a slot in the chassis. A second side of the chassis faces free space and includes a second aperture that has a dimension that comprises a second subwavelength width of the slot in the chassis. A channel connects the first aperture and the second aperture. The slot has a length dimension and the channel may be centered along the length dimension. The channel is configured to support a transverse electromagnetic mode for propagation of the signal from the first aperture through the channel to the second aperture. As a part of a mobile device the chassis acts as a secondary radiator for the mobile device.

Wi-gig signal radiation via ground plane subwavelength slit

Growing community of inventors

Oranit, Israel

Omer Asaf