Meta Platforms Technologies, LLC

Omar Awartani

Felippe Jose Pavinatto

Cameron Elliot Glasscock

Zhenzhen Shen

Allison Tuuri

Marcos Antonio Santana Andrade, Jr

Aleksey Reiderman

Lichuan Chen

The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.

Systems, methods, and devices for producing interconnects on deformable substrates of electronic devices

Growing community of inventors

Redmond, WA, United States of America

Omar Awartani