Infineon Technologies Ag

Olivier Rizzo

Hanno Melzner

Jacques Herry

A method for simplifying metal shapes in an integrated circuit including receiving an incoming wire layout for at least one metal layer of an integrated circuit, the incoming wire layout for the at least one layer including a plurality of wires running in a preferred direction and a plurality of vias connected thereto. The method further includes segmenting each of the wires into a plurality of bricks according to a set of equally spaced parallel grid lines extending in direction which is perpendicular to the preferred direction such that each wire comprises a series of consecutive bricks with brick boundaries between consecutive bricks occurring at a grid line, defining each brick as a regular or complex brick based on at least one brick criteria, and defining brick groups based on one or more grouping criteria, wherein each group contains one or more consecutive bricks of a same wire and each brick belongs to only one group so that each wire comprises a series of one or more consecutive groups, and wherein groups containing at least one complex brick are defined as complex groups.

Method of making in an integrated circuit including simplifying metal shapes

Method of making an integrated circuit including simplifying metal shapes

A method is provided for optimizing routing on a substrate such as an integrated circuit or printed circuit board. The method defines a plurality of parallel strips on an initial routing layout of conductors for a layer of an integrated circuit. Each conductor within each strip defines a brick. For each of the plurality of strips, a spacing between bricks and a brick thickness of each brick is adjusted as a function of i) a location of a brick in adjacent strips corresponding to the same conductor; ii) a desired brick thickness; and iii) a desired brick spacing.

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Roquebrune/Argens, France

Olivier Rizzo