3d Plus

Olivier Lignier

Christian Val

Regis Bocage

The invention relates to a 3D electronic module comprising a stack () of at least a first slice () and a second slice (), the first slice () having on a face () at least one set () of electrically conductive protrusions (), and the second slice () comprising at least one zone () of electrically insulating material, traversing the thickness of the slice. The second slice () comprises at least one electrically conductive element () traversing said slice in a zone () of electrically insulating material, able to receive a set () of protrusions () of the first slice ().

3D electronic module

A method for interconnecting active and passive components in two or three dimensions, and the resulting thin heterogeneous components. The method comprises: positioning and fixing () at least one active component and one passive component on a flat support (), the terminals being in contact with the support, depositing () a polymer layer () on all of the support and the components, removing the support (), redistributing the terminals () between the components and/or toward the periphery by metal conductors () arranged in a predetermined layout, making it possible to obtain a heterogeneous reconstituted structure, heterogeneously thinning () the structure by nonselective surface treatment of the polymer layer and at least one passive component ().

Method for the interconnection of active and passive components and resulting thin heterogeneous component

The present invention relates to an electronic device incorporating a heat distributor. It applies more particularly to devices of the plastic package type, with one or more levels of components. According to the invention, the electronic device, for example of the package type, is provided for its external connection with pads distributed over a connection surface. It includes a thermally conducting plate lying parallel to said connection surface and having a nonuniform structure making it possible, when the device is exposed to a given external temperature, to supply a controlled amount of heat to each external connection pad according to its position on the connection surface. If the device is a package comprising a support of the printed circuit type, the conducting plate will advantageously form an internal layer of said support.

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Versailles, France

Olivier Lignier