Commissariat a L'energie Atomique Et Aux Energies Alternatives

Olivier Castany

Jean-Louis Pornin

Jean Charbonnier

Nadia Miloud-Ali

Nohora-Lizeth Caicedo Panqueva

Yezouma-dieudonne Zonou

Yezouma-Dieudonné Zonou

An integrated optical component, including a transparent pad arranged on the upper face of the basic optical component, the transparent pad including a plane mirror at its upper face, and the basic optical component including a convergent mirror at its upper face, the plane and convergent mirrors being arranged such that the light beam is propagated between the internal light gate and the external light gate by passing through the transparent pad by reflection on the plane mirror and by reflection on the convergent mirror.

Integrated optical component having an expanded light beam

A method for assembling components includes assembling a first component including solder bumps with a second component including connectors. The assembly of the components is preceded by pre-treating the first and second components wherein the solder bumps are contacted with a pre-treatment liquid configured to at least partially remove an oxide layer initially present on the solder. The pre-treatment liquid is an aqueous solution containing carboxylic acids or polycarboxylic acids. The assembly of the components is carried out after the pre-treatment in the absence of liquid or gas flux.

Method for assembling components implementing a pre-treatment of the solder bumps allowing an assembly by fluxless and residue-free soldering

A process for exposing at least one region of a face, known as the front face, of an electronic device, the process including the following steps: A bonding step for a cover () to the front face, the bonding being undertaken such that the cover () forms a closed cavity () with the region, advantageously hermetically sealed; Formation of an encapsulation coating (), of thickness E, covering the front face and the cover (); A thinning step for the encapsulation coating (), the thinning step including removal of a removal thickness E, less than the thickness E, of the encapsulation coating (), the removal thickness Ebeing adjusted such that an opening is formed in the cover ().

Growing community of inventors

Grenoble, France

Olivier Castany