Oberthur Technologies

Idemia France

Olivier Bosquet

Elodie Gragnic

François Launay

Ahmed Ali

Denis Vere

Philippe Gac

Gregory Simonneaux

Mickael Huet

Mourad Laknin

Aurélie Barbotin

Julie Kerhomen

Rémi Lavarenne

Philippe Lencou

Christophe Capitaine

Jean-Francois Boschet

Lucien Amiot

Gregory Simmoneaux

Mouy-Kuong Sron

Mickaël Huet

Grégory Simmoneaux

Grégory Simoneaux

An electronic wireless communication device () that includes first and second electronic chips (); a first antenna () electrically connected to the first electronic chip (); a second antenna () electrically connected to the second electronic chip (); and a third antenna () that is adapted to be electromagnetically coupled with the first and second antennas (). The first electronic chip () is configured to communicate with a first external terminal using a first protocol via a first antenna pair formed by the first antenna () and the third antenna (); and the second electronic chip () is configured to communicate with the first external terminal and/or a second external terminal using a second protocol via a second antenna pair formed by the second antenna () and the third antenna ().

Electronic wireless communication device having two electronic chips and a method of fabricating such a device

A microcircuit card including an overall span of contacts including at least individual contact surfaces connected to this microcircuit while defining two parallel columns situated in proximity to two edges of the overall span, in a card body having a format at least equal to the 2FF format, in which there is made a pre-cutout in the 4FF format surrounding the overall span of contacts and a pre-cutout in the 3FF format surrounding the pre-cutout in the 4FF format, these pre-cutouts being such that the individual contact surfaces have, with respect to each of the pre-cutouts, positions and dimensions such that they encompass the theoretical contact zones defined by the standards defining these 4FF, 3FF and 2FF formats, the upper edge of the pre-cutout in the 3FF format being situated at a distance at least equal to 400 micrometers from the upper edge of the pre-cutout in the 4FF format.

Microcircuit card containing multiple pre-cutout cards having one and the same span of contacts

Disclosed is an antenna support for incorporating in an electronic document. The support can include a first substrate made of a plastics material that is defined by first and second opposite faces, which define between them a thickness of the substrate. The antenna can include one or more turn that extends between two ends, and the antenna can be formed by a wire that is inlaid in the thickness of the first substrate from the first face, such that each of the two ends presents a zigzag shape formed by at least two rectilinear portions and by two bends. The bends can be inlaid more deeply than the rectilinear portions in the thickness of the first substrate from the first face.

Antenna carrier intended for being built into an electronic document

A method and tooling for fabricating a thin plastic plate of large format and of large thickness and including a card of small format and of small thickness that is detachable from the plate. The method, which may be implemented using the tooling, includes operations for making a spotface in a face of the plate to a depth equal to the difference between the large thickness and the small thickness; punching in the spotface zone along a leveling direction facing another face of the plate opposite from the first face, to a leveling stroke (e) equal to the depth of the spotface, in order to bring the bottom of the spotface level with the first face of the plate; and pre-cutting an outline of the card within the leveled zone, in order to make the card detachable.

Fabricating a plate of large thickness including a detachable card of small thickness

Disclosed are a method of weakening an outline in a thin plastic card and tooling for performing the method. The method may include several operations, including a go punching step by means of a go punch presenting a solid shape substantially identical to the outline and suitable for punching the thin plastic card along a go direction against a die presenting a hollow shape substantially identical to the outline and in alignment with the go punch in order to be able to receive material pushed by the go punch, and a return punching step by means of a return punch presenting a solid shape substantially identical to the outline in alignment with the go punch and suitable for punching the thin plastic card along a return direction opposite to the go direction. Also disclosed is a thin plastic card including at least one outline weakened by such a method.

Tooling and a method for weakening an outline in a thin plastics card

The fabrication of an electronic document includes the following steps: &#x2014;obtaining of a flat body in which is made a cavity of globally rectangular shape including a deep portion surrounded by a countersink and which contains an electronic component having connection terminals situated on this countersink while having the shape of meandersA,B, &#x2014;obtaining of a module including a support furnished on a so-called external face with a plurality of external contact zones and on a so-called internal face with a printed circuit including connection padsA,B of hefty form while being connected to certain at least of the external contact zones, the support being furthermore furnished, on this internal face, with a microcircuit connected to this printed circuit, this module being encased in the cavity by an anisotropic conducting adhesive whose overlap coefficient lies between 5 and 8%.

Electronic document such as a chip card with reduced metallization

Disclosed is an electronic document, such as an integrated circuit card, that includes a body having a cavity that opens into one of the faces of the body and is defined by walls. The body also includes: an antenna having at least one turn extending between two ends that terminate in a wall of the cavity, a module including a microprocessor and at least two connection terminals dedicated to the antenna and electronically connected by electrical connections firstly to the microprocessor and secondly to the ends of the antenna. The ends of the antenna are arranged in zigzag shapes and each of them is made up of at least two rectilinear portions that are connected together by a bend and in which the rectilinear portion terminating in the cavity is at an angle of inclination relative to the wall at which it terminates.

Electronic document having angled antenna ends, antenna holder for such an electronic document and method for manufacturing such a document

In an assembly including an adapter and a smart card, the outer dimensions of the adapter are compliant with the 3FF microcircuit card format, the format further defining the positioning and minimum dimensions of contact areas; the smart card includes a plurality of contact surfaces, the dimensions of which are greater than those defined by the 3FF format for the contact areas, the outer dimensions of the card being smaller than those of the 3FF format; and the adapter includes a recess, the outline of which is defined by a plurality of arms that surround the recess, the recess being shaped so as to receive the smart card so the contact areas of the adapter fit inside the contact surfaces of the smart card, each of the contact areas being off-center relative to each of the contact surfaces, so each arm has a width of 700 micrometers, ensuring mechanical stability.

Assembly comprising an adapter and a smart card

A method of manufacturing a card () of small format () and small thickness (), detachable from a plate () of large thickness (), includes the following steps: providing in the plate () of large thickness () at least one hole () opposite with a cumulative depth () equal to the difference between the large thickness () and the small thickness (), pre-cutting of the card () of small format () in the at least one hole (). The product obtained by such a method is also described.

Method of manufacturing a card of small thickness detachable from a plate of large thickness

A microcircuit module for a smart card includes a generally rectangular carrier film () provided with eight contact pads on a first face thereof and with an electronic component on a second face, the electronic component being equipped with connection terminals to which the contact pads are connected via the carrier film. The eight contact pads are disposed in two parallel series of three contact pads (C, C, C, C, C, C), with two other contact pads (C', C&#x2032;) being disposed therebetween and each being positioned close to the contact pads from the ends of each of the series. The contact pads each measure at least 1.7 mm&#xd7;2 mm. The contact pads of the two parallel series comply with ISO standard 7816 and the eight contact pads border each of the sides of the carrier film.

Microcircuit module of reduced size and smart card comprising same

The device () includes a near-field communication antenna () delimiting a useful magnetic field receiving area (S), a microcircuit () connected to the antenna () and a magnetic shielding layer () arranged so as to extend at least partially under the area (S). It also includes a support () built into a microcircuit card body () including an open cavity () in one of its faces (F) extending at least partially under the antenna area (S) and sized so as to completely accommodate the shielding layer (). More specifically, the body () includes a detachable plate () within which are arranged the antenna () and the microcircuit () and within which the layer () extends at least partially.

Contactless electronic device, process for manufacturing the device and contactless electronic tag

A microcircuit card () and held within a carrier card () is generally shown asin FIG.. The microcircuit card () is bounded on all edges except one edge () which is free. The free edge () is substantially in alignment with an edge () of a carrier card (). The microcircuit card and carrier card are held together by connections (), which can be broken to release the microcircuit card () so it can be used independently of the carrier card. The position of the microcircuit card allows it to be easily and cleanly removed from the carrier card.

Microcircuit card and a tool and method for making thereof

A fabrication method for a device having a body having a cavity of dimensions suitable for receiving a module having a microcircuit, the cavity having a bottom and a peripheral wall surrounding the bottom, the method including a step of putting the module into place in the cavity. More precisely, the method comprises, prior to the step of putting the module into place, a step of depositing an adhesive strip at least on a surface of the module that is designed to face the bottom of the cavity, the adhesive strip being suitable for enabling the module to adhere at least to the bottom of the cavity and for limiting a deformation stroke of the module that could occur under the effect of a mechanical compression force urging the module against the bottom of the cavity.

Method of fabricating a microcircuit device

A support that includes a detachable element which has one border, of which at least a portion is attached to the support, with the border portions attached to the support all being so attached by weakened attachment seams, where the support also includes at least two lines of weakness that allow the support to be separated into at least two portions connected by a weakened attachment seam to the detachable element, with each of the lines of weakness being such that, when the support is bent along this line of weakness until it breaks, none of the weakened attachment seams breaks totally. Also disclosed is a method for the detachment of such a detachable element as well as a method for the manufacture of such a support.

Support that includes a detachable element, a method for the detachment of such a detachable element, and method for the manufacture of such a support

The smart card comprises a module having a microcircuit and a body including a cavity for receiving the module, wherein the cavity defines at least one surface area for fastening the module in the cavity, the body being formed by a stack of at least first and second layers respectively presenting weak adhesion and strong adhesion with the module. The area extends in the weak adhesion layer and includes at least one hole leading to the strong adhesion layer so as to form an anchor point for the module directly with said layer.

Growing community of inventors

Vitre, France

Olivier Bosquet