Intel Corporation

Olivia Chen

Wei-Lun Kane Jen

Yun Ling

Li-Sheng Weng

Chi-Te Chen

A microelectronic structure may be formed comprising a microelectronic package having a plurality of interconnects and a microelectronic substrate including an upper metallization layer and a solder resist structure, wherein the solder resist structure includes a first structure which forms an electrical connection between a first interconnect of the plurality of interconnects of the microelectronic package and the upper metallization layer of the microelectronic substrate, and wherein solder resist structure includes a second structure which prevents second interconnect of the plurality of interconnects of the microelectronic package from making electrical contact with the upper metallization layer.

Growing community of inventors

Folsom, CA, United States of America

Olivia Chen