Schott Ag

Schott Glas

Oliver Wolfgang Fritz

Peter Brix

Thomas Fink

Dietrich Mund

Joern Besinger

Georg Meier

Helmar Vetter

Clemens Ottermann

Juergen Suttner

Andreas Steinberg

Josef Nisslbeck

Joern Pommerehne

Clemens Otterman

Jörn Pommerehne

A feedthrough for shielding against radioactive radiation includes electrical feedthrough conductors, a tubular metal housing, a connecting conductor, and shielding bodies. The tubular metal housing includes ends and seals, the ends including a seals so that an interior is formed in the tubular housing between the seals. The seals include an insulating body through which an electrical feedthrough conductor is fed so that the electrical feedthrough conductor is fixed in the seals while electrically insulated from the tubular housing. The connecting conductor extends in the interior and connects an electrical feedthrough conductor at one of the seals to an electrical feedthrough conductor at another of the seals. The shielding bodies, which are respectively interrupted by at least one opening therein, are arranged successively in an axial direction of the tubular housing, the connecting conductor being fed through the opening. The shielding bodies shield against radioactive radiation by way of shielding material.

Cable feedthrough for radioactive environments

An electrical feedthrough is providing that includes a base body, an insulating material, an electrical conductor, a creepage distance extension, and a sealing member. The base body has a through opening extending therethrough. The insulating material is in the through opening. The electrical conductor extends through the insulating material such that a portion of the electrical conductor protrudes from the insulating material. The creepage distance extension surrounds at least a section of the portion. The sealing member is between the insulating material and the creepage distance extension. The sealing member is a seal material that is at least partially mineral and crystalline.

Electrical feedthrough

A method for joining a cable to a connector includes: providing an electrically conductive fusible conductor joining material which has a lower melting point than that of at least one inner conductor of the cable and/or at least one contact of the connector; bringing an end of the connector to an end of the cable such that at least one inner conductor of the cable and at least one contact of the connector are opposite one another and the fusible conductor joining material is present in between; and heating the cable and/or the connector from the outside such that the heat penetrates into an interior of the at least one heated cable or the connector so the fusible conductor joining material melts and electrically connects the at least one inner conductor of the cable and the contact of the connector to one another.

Method for connecting two mineral-insulated cables, arrangement having two mineral-insulated cables joined to one another, and also cable, shaped element and joining kit for joining two cables

A method for joining a first cable to a second cable that each include at least one electrically conductive inner conductor, an outer sheath which at least partially surrounds the at least one inner conductor, and an insulation material which is arranged at least partially between the at least one inner conductor and the outer sheath. The method includes: bringing an end of each cable together such that at least one inner conductor of the cables are opposite one another and a fusible conductor joining material having a lower melting point than the at least one inner conductor is present in between; and heating at least one of the cables from the outside such that the heat penetrates into an interior of the at least one heated cable so the fusible conductor joining material melts and electrically connects the at least one inner conductor of the cables to one another.

A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20&#xb0; C. to more than 450&#xb0; C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.

Lead-through or connecting element with improved thermal loading capability

A feed-through is provided that includes a flange and a first functional component. The flange has a through-opening in which the first functional component is arranged and is connected to the flange such that the through-opening is sealed. The first functional component has at least one deformation region, in which a recess is provided such that the mechanical stability of the first functional component is reduced in the deformation region. In this manner, the first functional element can be deformed in the deformation area when mechanical load is applied.

Fault-proof feed-through device

A process for producing increased service life of organic, electro-optical elements is provided. The process includes the steps of: providing a substrate, applying a first conductive layer, applying at least one layer that includes at least one organic, electro-optical material, applying a second conductive layer, and depositing at least one layer with a vitreous structure.

Hermetic encapsulation of organic, electro-optical elements

The method for producing glass-coated electronic components includes processing a lead-free glass with a liquid to form a suspension, applying the suspension on an electronic component body and subsequently sintering the component body with the suspension on it. The lead-free glass contains, in % by weight, SiO, 3-12; BO, 15-&#x3c;25; AlO, 0-6; CsO, 0-5; MgO, 0-5; BaO, 0-5; BiO, 0-5; CeO, 0.01-1; MoO, 0-1; SbO, 0-2 and ZnO, 50-65. The method can be used to passivate electronic components.

Method for producing an electronic component passivated by lead free glass

The invention relates to a method for the production of glass-coated electric components, wherein the components are, inter alia, passivated by the application of the glass. The lead-free glass used is not affected through purification and processing steps and the electric component is protected from mechanical damaging and other detrimental influences, such as impurities. Further, the method remarkably helps to stabilize the electrical properties of the components. Inter alia, a sufficient acid resistance is achieved and it results in an improvement of the expansion adjustment of the glass.

A process for producing organic, electro-optical elements includes the steps of: providing a substrate, applying a first conductive layer, applying at least one layer which includes at least one organic, electro-optical material, applying a second conductive layer, and depositing at least one layer with a vitreous structure.

The lead-free glass tubing of the SiO&#x2014;BO&#x2014;RO&#x2014;BaO&#x2014;ZnO&#x2014;TiOsystem has a composition, in percent by weight on an oxide basis, consisting essentially of: SiO, 34 to 52; BO, 10 to 25; AlO, 0 to 25; LiO, 2 to 6; NaO, 4 to 10; KO, 2 to 6; CaO, 0 to 4; BaO, 1 to 5; ZnO, 4 to 12; TiO, 2 to 6, and at least one refining agent in an effective amount for refining. An encapsulated diode consisting of a diode encapsulated with this lead-free glass tubing is also disclosed.

Lead-free glass tubing, especially for encapsulating diodes and diodes encapsulated with same

To hermetically seal a fiber optic light guide ( ) in a stripped or de-coated state, I.e. the bare optical fiber ( ), in a feedthrough sleeve ( ) the bare optical fiber ( ) is sealed together with the feedthrough sleeve ( ) by composite-glass solder with local heating. To make a permanent hermetic glass seal, the feedthrough sleeve ( ) is made from an Invar alloy with very low thermal expansion and the composite-glass solder is low-melting with thermal expansion properties adapted to the alloy. The composite-glass solder is molded into prefabricated half-cylinder-shaped pressed parts ( ) in a press/sinter technology process, The stripped optical fiber ( ) is inserted between the pressed parts ( ) arranged in the feedthrough sleeve ( ) and sealed by melting the pressed parts together with each other and with the stripped optical fiber and feedthrough sleeve.

Method of hermetically sealing a fiber optic light guide in a metallic feedthrough sleeve with glass solder and hermetically sealed feedthrough device made thereby

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Obersuessbach, Germany

Oliver Wolfgang Fritz