Avago Technologies International Sales Pte. Limited

Oliver Wiedenmann

Lueder Elbrecht

Bernhard Gebauer

Martin Handtmann

Sarah Kay Haney

Deog-Soon Choi

Martin Fritz

Aaron Lee

Sergej Scherer

Electrically-conductive wires are used to construct an EMI shield between inductors of an RF module that prevents, or at least reduces, EMI crosstalk between the inductors while maintaining high Q factors for the inductors. The EMI shield comprises at least a first set of electrically-conductive wires that at least partially surrounds and extends over at least a first inductor of a pair of inductors. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire in between the first and second ends of the respective wire extends above the first inductor and is spaced apart from the first inductor so as not to be in contact with the first inductor.

Systems and methods for providing electromagnetic interference (EMI) shielding between inductors of a radio frequency (RF) module

An apparatus, includes a substrate, an electronic component disposed over the substrate, and a frame element disposed over the substrate. The frame element provides structural rigidity to the apparatus. The apparatus also includes an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element. An electrically conductive layer is disposed over the encapsulating material.

Frame elements for package structures comprising printed circuit boards (PCBs)

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Munich, Germany

Oliver Wiedenmann