Ems-patent Ag

Oliver Thomas

Botho Hoffmann

Nikolai Lamberts

Andreas Bayer

Manfred Hewel

Georg Stoppelmann

Georg Stöppelmann

Takamasa Fujii

Minoru Hatta

Thermoplastic moulding composition consisting of

Polyamide moulding composition for extrusion blow moulding

The present invention relates to polyamide moulding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to moulded articles produced from these polyamide moulding compounds as components in the automobile or electrics/electronics sector.

Polyamide molding compounds and molded articles produced therefrom

A molding compound consisting of the components: (A)-(E), wherein the sum of (A)-(E) makes up 100 wt. %. Component A is 40-70 wt. % of at least one partially crystalline polyamide, made up of: (a1) 60-75 wt. % of 6T units; (a2) 20-35 wt. % of 6I units; (a3) 3-15 wt. % of 612 units; (a4) 0-5 wt. % of one of the following units: 66; 68; 69; 610; 6; or a mixture of such units; wherein the sum of (a1) to (a4) makes up 100 wt. % of (A). Component (B) is 30-60 wt. % of fibrous reinforcing materials. Component (C) is 0-30 wt. % of particulate fillers different from (B), (D) and (E). Component (D) is 0-2.0 wt. % of heat stabilizers, and component (E) is 0-6 wt. % of auxiliary agents and/or additives, different from (A)-(D).

High temperature-resistant polyamide moulding compounds and uses thereof especially in the automotive sector

The present invention relates to polyamide molding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to molded articles produced from these polyamide molding compounds as components in the automobile or electrics/electronics sector.

The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.

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Domat/Ems, Switzerland

Oliver Thomas