Siemens Aktiengesellschaft

Snaptrack Incorporated

Oliver Freudenberg

Karl Weidner

Harry Hedler

Maximilian Fleischer

Alexander Frey

Jörg Zapf

Jürgen Portmann

Kerstin Wiesner

Markus Schieber

Claus Reitlinger

Stefan Kiefl

Andreas Franz

Manfred Schreiner

Gerald Eckstein

Ingo Kühne

The present invention relates to a module that has a lower component of a module () having a material () in which at least one first structural element () is embedded, and an upper component of a module () having a material () in which at least a second component () is embedded. The upper component of the module () and the lower component of the module () are stacked, with the lower and the upper component of the module () being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.

Stacked modules

At least two separate single-crystal silicon layers are formed in a micromechanical substrate which has a diaphragm in a partial region. The diaphragm has a thickness of less than 20 &#x3bc;m and includes part of a first of the single-crystal silicon layers. The substrate construction also includes a heating element configured to generate a temperature of more than 650&#xb0; C. in at least part of the diaphragm. The substrate includes at least one diffusion barrier layer that reduces the oxidation of the first single-crystal silicon layer.

Micromechanical substrate for a diaphragm with a diffusion barrier layer

A connection device for random connection of a first member of first transmission/reception units with a second number of second transmission/reception units has a switching matrix that includes a third number of controllable micromechanical switching elements that are respectively activatable to establish a connection between one of the first transmission/reception units and one of the second transmission/reception units. A control circuit selectively activates the respective micromechanical switching elements to selectively establish respective connections between the first number of first transmission/reception units and the second number of transmission/reception units.

Method for manufacturing connecting device for randomly connecting a number of transmitters and receivers

Growing community of inventors

Munich, Germany

Oliver Freudenberg