Lam Research Corporation

Oleksandr Mikhnenko

Changyou Jing

Christopher Kimball

Benny Wu

Slobodan Mitrovic

A substrate support assembly includes a baseplate, a ceramic plate arranged on the baseplate, and a plurality of wires. The ceramic plate includes a plurality of slots arranged on a side facing the baseplate and a plurality of electrically conducting terminals disposed in the plurality of slots, respectively. Each of the terminals includes a base portion connected to the ceramic plate, a second portion extending from the base portion towards the baseplate, and an opening in the second portion extending from an end of the second portion adjacent to the base portion to a distal end of the second portion. Each of the wires passes through the opening of the respective terminal and is braided around the distal end of the second portion of the respective terminal.

Method of mounting wires to substrate support ceramic

A controller including a voltage sensor coupled to a heater trace integrated in an electrostatic chuck, the voltage sensor configured to sense a voltage difference across the heater trace, wherein the heater trace is associated with a heater zone. The controller including a current sensor coupled to the heater trace and configured to sense a current in the heater trace. The controller including a resistance identifier configured to identify a resistance of the heater trace based on the voltage difference and the current that is sensed. The controller including a temperature correlator configured to approximate a temperature of the heater zone based on the resistance and a correlation function of the heater trace. The correlation function uses a temperature coefficient of resistance of the heater trace.

Electrostatic chuck heater resistance measurement to approximate temperature

Systems and methods of the disclosure perform in situ sensing and real time compensation of various non-uniformities in substrate processing systems. A plasma non-uniformity is sensed by determining a temperature distribution across a matrix of a plurality of micro-heaters disposed in the substrate support. Alternatively, the plasma non-uniformity is sensed by determining heat flux through the substrate support using the matrix heaters and one or more heaters used to heat one or more zones of the substrate support. The plasma non-uniformity is compensated by adjusting one or more parameters such as power supplied to the matrix heaters, RF power supplied to generate plasma, chemistry and/or flow rate of gas or gases used to generate plasma, settings of thermal control units or chillers, and so on. Additionally, non-uniformities inherent in the substrate support are sensed using the zone and matrix heaters and are compensated by adjusting the one or more parameters.

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San Diego, CA, United States of America

Oleksandr Mikhnenko