Ati International Srl

Ati Technologies Ulc

Ati Technologies Inc.

Advanced Micro Devices Corporation

Oleg Drapkin

Grigori Temkine

Gordon Caruk

Carl K Mizuyabu

Filipp Chekmazov

Grigory Temkine

Arvind Bomdica

Kevin Yikai Liang

Kristina Au

Milivoje M Aleksic

Adrian H Hartog

Michael Foxcroft

Paul Edelshteyn

Edward George Callway

Richard Sita

Aris Balatsos

Antonio A Rinaldi

Mikhail Rodionov

Ming L So

Kuldip Sahdra

Peter L Rosefield

Chak Cheung Ho

Ray Chau

Siji Menokki Kandiyil

Samu Suryanarayana

Yamin Du

Chak Cheung Edward Ho

Marcus Ng

Grigori Temkin

Peter Bade

Mikhall Rodionov

Ho Ming Wan

Ngar Sze Chan

Roche Thambimuthu

Grigori Tempkine

Methods and apparatus for providing multiple graphics processing capacity, while utilizing unused integrated graphics processing circuitry on a bridge circuit along with an external or discrete graphics processing unit is disclosed. In particular, a bridge circuit includes an integrated graphics processing circuit configured to process graphics jobs. The bridge circuit also includes an interface operable according to interface with a discrete graphics processing circuit. A controller is included with the bridge circuit and responsive whenever the discrete graphics processing circuit is coupled to the interface to cause the integrated graphics processing circuit to process a task of the graphics job in conjunction with operation of the discrete graphics processing circuit that is operable to process another task of the graphics job. Corresponding methods are also disclosed.

Methods and apparatus for processing graphics data using multiple processing circuits

A system and method for measuring integrated circuit (IC) temperature. An integrated circuit (IC) includes a thermal sensor and data processing circuitry. The thermal sensor utilizes switched currents provided to a reference diode and a thermal diode. The ratios of the currents provided to each of these diodes may be chosen to provide a given delta value between the resulting sampled diode voltages. At a later time, a different ratio of currents may be provided to each of these diodes to provide a second given delta value between the resulting sampled diode voltages. A differential amplifier within the data processing circuitry may receive the analog sampled voltages and determine the delta values. Other components within the data processing circuitry may at least digitize and store one or both of the delta values. A difference between the digitized delta values may calculated and used to determine an IC temperature digitized code.

Dynamic voltage reference for sampling delta based temperature sensor

A reference voltage generator is provided. In an example, the reference voltage generator includes a temperature-dependent device, a processing module configured to process a digital representations of first and second voltages derived from the temperature-dependent device and a reference voltage to determine a value, and a digital to analog converter (DAC) configured to generate a reference voltage based on the value. The first voltage is proportional to absolute temperature (PTAT) and the second voltage is complementary to absolute temperature (CTAT) and the reference voltage is substantially independent of absolute temperature in an operating temperature range of the reference voltage generator.

Self-calibrating digital bandgap voltage and current reference

A method and circuitry for determining a temperature-independent bandgap reference voltage are disclosed. The method includes determining a quantity proportional to an internal series resistance of a p-n junction diode and determining the temperature-independent bandgap reference voltage using the quantity proportional to an internal series resistance.

Auto-calibrating a voltage reference

The present invention provides embodiments of an apparatus that includes a pad configurable for connection to a voltage source that provides a first voltage and a buffer connected to the pad. The buffer includes a plurality of transistors that have nominal breakdown voltages that are less than the first voltage. The buffer is configured to maintain voltage differentials on the plurality of transistors that are less than the break-down voltage of the plurality of transistors during pull-down of a pad voltage from the first voltage to a selected low voltage level or during pull-up of the pad voltage from the selected low voltage level to the first voltage.

Complementary metal oxide semiconductor (CMOS) buffer

An integrated circuit is capable of controlling a communication signal by using power ramp controlled communication buffer logic to generate an outgoing communication signal based on a detected voltage on a voltage source. The voltage source is necessary to supply power for power ramp controlled communication buffer logic. The voltage on the voltage source may be detected using power ramp sensor logic. The outgoing communication signal is based on a core logic output signal if the detected voltage is greater than or equal to a predetermined voltage level. If, the detected voltage is less than the predetermined voltage level, the outgoing communication signal is predetermined to be one of: a tristate outgoing communication signal, a logic one outgoing communication signal and a logic zero outgoing communication signal. Power ramp controlled communication buffer logic may also generate a core logic input signal based on an incoming communication signal in response to the detected voltage.

Method and apparatus for controlling a communication signal by monitoring one or more voltage sources

A circuit includes an input/output buffer circuit. The input/output buffer circuit includes an output buffer circuit and a bias control circuit. The output buffer circuit provides an output voltage in response to output information. The bias control circuit provides an output buffer bias voltage based on the output voltage.

Input/output buffer circuit

A method includes generating a first, second and third voltage output from a temperature sensing element of an integrated circuit using a respective, corresponding first, second and third, switched current source, for sequentially switching a respective first, second and third excitation current through the temperature sensing element. The third switched current source generates the corresponding third voltage output as a reference voltage between the first voltage and the second voltage. An error corrected difference is calculated between the first voltage and the second voltage using the reference voltage. In the method, the second excitation current is proportional to the first excitation current by a value n, and the third excitation current is proportional to the first excitation current by the square root of n.

Method and apparatus for integrated circuit temperature control

A method and integrated circuit renders a shunt structure non-conductive during a power up event or noise event for and in addition, during an electrostatic discharge event, keeps the shunt structure conductive for a period of time to discharge electrostatic energy through the shunt structure. In one example, a shunt structure, such as a transistor, is interposed between a power node and a ground node. Circuitry is operative during a power up event or noise event, to render the shunt structure non-conductive for a period of time during the power up event or during the noise event (when power is applied). Second circuit is operative, during an electrostatic discharge event, to keep the shunt structure conductive for a period of time to discharge electrostatic energy through the shunt structure. In one example, a plurality of resistor/capacitors (RC) circuits are utilized wherein the RC circuits have different time constants. In addition, an ESD feedback circuit is employed in conjunction with control logic to suitably control the ESD control logic during an ESD event. Circuitry is also used during a power up event to render the shunt structure non-conductive.

Electrostatic discharge circuit and method

Various capacitors for use with integrated circuits and other devices and fabrication methods are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first capacitor plate that has at least two non-linear strips and forming a second capacitor plate that has a non-linear strip positioned between the at least two non-linear strips of the first capacitor plate. A dielectric is provided between the non-linear strip of the second capacitor plate and the at least two non-linear strips of the first capacitor plate.

Chip capacitor

A circuit includes a phase lock loop circuit and a continuous phase lock loop calibration circuit. The continuous phase lock loop calibration circuit is operatively coupled to the PLL circuit and produces a continuous calibration signal based on a reference voltage from a reference voltage circuit to calibrate the PLL circuit on a continuous basis.

Phase lock loop with continuous calibration and method therefor

An input signal is routed to a first logic one reference signal generator or alternatively routed to a second logic one reference signal generator based at least one a voltage level of the input signal. When the voltage level of the input signal is less than a threshold value, the first logic one reference signal generator selectively generates a first logic one reference signal. When the voltage level of the input signal is greater than or equal to the threshold value, the second logic one reference signal generator alternatively generates a second logic one reference signal. The first and second logic one reference signals may be used to control a first voltage scaling circuit that drives a scaled output signal having a logic one value corresponding to the voltage level of the first logic one reference signal.

Method and apparatus for generating a reference signal and generating a scaled output signal based on an input signal

A differential signal comparator includes an input circuit operative to provide an absolute input current difference value that is associated with the absolute difference of differential input signal levels, and a reference circuit operative to provide an absolute reference current difference value that is associated with the absolute difference of the reference signal levels. Current comparison of the absolute input current difference value with the absolute reference current difference value identify whether an input differential signal is bigger than the reference noise level and should be processed, or an input differential signal is smaller than the reference noise level and should not be processed.

Differential signal comparator

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Richmond Hill, Canada

Oleg Drapkin