Danfoss Silicon Power Gmbh

Ole Mühlfeld

Lars Paulsen

Klaus Kristen Olesen

Holger Beer

Martin Becker

Michael Tønnes

Henning Ströbel-Maier

Klaus Olesen

Christopher Klaehr

Matthias Beck

Georg Wecker

Holger Ulrich

Tim Rettmann

A power module () including a rigid insulated substrate () mounted on a baseplate () is disclosed. An additional circuit carrier () is mounted on the baseplate () adjacent to the rigid insulated substrate (). The additional circuit carrier () has a rigidity which is less than that of the rigid insulated substrate ().

Power module

A power module () including a molded package (), three power terminals () protruding from a first side () of the molded package () is disclosed. The power terminals () include a positive DC terminal (), a neutral terminal () and a negative terminal (). The power module () includes a phase output power terminal () protruding from a second side () of the molded package (). The power module () is a three-level power module including a plurality of control pins () protruding from the second side () of the molded package ().

Three-level power module

The invention relates to an electronic power system () comprising at least one electronic power module (). The electronic power module () comprises a base plate () and at least one heat generating component arranged on a first side of the base plate (). The electronic power module () comprises a cooling structure () transporting heat away from the electronic power module () via a coolant that is guided by the cooling structure (). The cooling structure () is arranged on a second side () of the base plate () opposite to the first side. Task of the invention is to provide an electronic power system () with an improved cooling. According to the present invention this task is solved in that the cooling structure () is integrally formed with the base plate ().

Electronic power system and method for manufacturing the same

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Nordborg, Denmark

Ole Mühlfeld