Daimler-benz Aerospace Airbus Gmbh

Henkel Ag & Company, Kgaa

Blanco Gmbh + Co Kg

Olaf Scheffler

Reinhard Koska

Karl Manderscheid

Jens Krömer

Peter Knepper

Alexandra Zver

Stefan Dietz

Udo Irmscher

Jan-Willem Brouwer

Hans-Bernhard Eppler

Markus Schulin

A solder material that is especially suitable for the fluxless hard soldering of aluminum-based components consists of an aluminum-based alloy that especially contains about 10 to 50 wt. % of germanium, about 1 to 12 wt. % of silicon, about 0.1 to 3 wt. % of magnesium, and about 0.1 to 3 wt. % of indium. The solder material is useful at soldering temperatures in the range from 424.degree. to about 600.degree. C., and is therefore especially suitable for the fluxless hard soldering of components made of precipitation-hardened high-strength aluminum-based materials.

Aluminum-based solder material

Growing community of inventors

Bremen, Germany

Olaf Scheffler