Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Olaf Ruediger Hild

Beatrice Beyer

André Philipp

Dirk Schlebusch

Susan Richter

Tae-hyun Gil

A method for manufacturing an organic device includes the steps of applying a photoresist onto at least an active first region arranged on a substrate of the organic device, and removing the photoresist from the substrate in a second region adjacent to the active first region. Additionally, the method includes the steps of applying a passivation layer onto the first and second regions and removing the photoresist and the passivation layer in the active first region.

Organic device and manufacturing method thereof

The invention relates to an arrangement including optically transparent and/or functional components. It is desirable for many applications to achieve a high functionality and variability in the utilization of electronic components over a very small area or with a small space requirement for such a design. In an arrangement in accordance with the invention, an organic electronic component and at least one further organic or inorganic electronic component are arranged layer-wise, stacked over one another, on a substrate. In this respect, planar electrically conductive electrodes at the surfaces of the components are formed such that the components are electrically connected in series and the components are each individually electrically controllable via the electrodes in accordance with their polarities.

Arrangement comprising optically transparent and/or functional components

A module and method of its production in which areal electronic components are formed. The module includes (a) a cover electrode covering the electronic components; (b) a flexibly deformable substrate; (c) a base electrode formed on the substrate; and (d) an optically active layer formed on the base electrode. The electronic components are formed on the flexibly deformable substrate by the optically active layer, the cover electrode; and the base electrode. The cover electrode projects over the optically active layer at a first side and the base electrode extends beyond the optically active layer at a second side which is oppositely disposed with regards to the first side. The components are arranged at a spacing from one another on the substrate and thereby a free substrate surface is present between components so that, on a folding in a region of the free substrate surface, the base electrode and the cover electrode are adjacent and contact one another areally and an electrically conductive touching contact is established. The electronic components are electrically connected in series with one another.

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Radebeul, Germany

Olaf Ruediger Hild