Hella Kgaa Hueck and Company

Meas France

Olaf Ludtke

Leonid Matsiev

John F Varni

G Cameron Dales

Oleg Kolosov

Heiko Dobrinski

Andreas Buhrdorf

Dirk Wullner

An improved method of packaging a sensor is provided. The method includes the step of affixing a tuning fork to a platform. The tuning fork includes tines comprising one or more surfaces, with each tine further comprising an electrode and a piezoelectric material. An application specific integrated circuit (ASIC) is affixed to the platform. Electrical communication between the ASIC and the electrode of each tine is established for providing stimulus to the tuning fork and for receiving a response signal from the tuning fork. A protective layer is applied to cover the platform and a portion of the tuning fork while maintaining a portion of a surface of each tine free from the protective layer such that the surface can displace the fluid in contact therewith.

Method of packaging a sensor

An improved method and assembly, wherein the method generally includes the steps of providing a coated or uncoated sensor element having an exposed sensing surface; attaching the sensor element to a platform so that the exposed sensing surface is spaced from the platform; and optionally applying a protective layer over the platform while maintaining the sensing surface as exposed. The assembly includes a resonator having a free portion with a sensing surface is incorporated onto a platform, components of the sensor are physically shielded from harsh operating conditions, the requisite space is maintained between the free portion of the resonator and the platform, and the sensing surface of the resonator remains exposed for sensing.

Resonator sensor assembly

Growing community of inventors

Munich, Georgia

Olaf Ludtke