Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Olaf Kurtz

Ralph Herber

Robert Rüther

Christian Madry

Heinrich Meyer

Jürgen Barthelmes

Joko Setyadi-Lie

Josef Gaida

Din-Ghee Neoh

Peter Prechtl

Tse-Cheen Foong

Sven Theisen

Carsten Schwiekendick

Robert Ruether

Thomas Moritz

Johannes Etzkorn

Konrad Cramer

Gerd Schäfer

Markus Höhn

Michael Danker

Florence Lagorce-Broc

Oleg Sprenger

Marta Sainz-Vila

Oliver Ringtunatus

Wolfgang Friz

Konrad Crämer

Jana Breitfelder

Juergen Barthelmes

Chee-Chow Tan

Jen Joo Lim

Chiho Arai

Robert RÜTHER

Setyadi-Lie Joko

Thomas Vago

The present invention relates to an aqueous passivation solution having a pH in the range from 5.4 to 7.2, the solution including

Method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy

A method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy, the method comprising the steps of

A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.

Electrodeposition method with analysis of the electrolytic bath by solid phase extraction

Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.

Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface

The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness &#x2266;3.0 &#x3bc;m, (ii) a Ni&#x2014;P layer having a thickness &#x2266;1.0 &#x3bc;m, and (iii) a Au layer having a thickness &#x2266;1.0 &#x3bc;m.

Ni-P layer system and process for its preparation

To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.

Method for bonding work pieces made of stainless steel, nickel or nickel alloys, using a bonding layer consisting of nickel-phosphorous, method for producing a micro-structured component using such method; micro-structured component obtained by such method

For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils () comprising channels () for coolant and one base plate () adapted to be brought into thermal contact with the electronic component () through a thermal contact surface (), said metal foils () and said base plate () being joined together so as to form a single piece of material, said channels () having a width b ranging from 100 to 350 &#x3bc;m, a depth t ranging from 30 to 150 &#x3bc;m, a mean spacing s ranging from 30 to 300 &#x3bc;m, residual foil thickness r remaining after formation of the channels () in the metal foils () ranging from 30 to 300 &#x3bc;m and said base plate () having a thickness g ranging from 100 to 1,000 &#x3bc;m.

Micro-structured cooler and use thereof

For manufacturing micro-structured reactors with passageways loaded with catalyst using the pre-coat method, a method is provided which comprises the following method steps: a) producing reactor layers having bonding areas as well as passageway areas in which the passageways are formed, b) applying at least one bonding layer onto the reactor layers in the bonding areas, c) loading the reactor layers in the passageway areas with the catalyst and d) bonding the reactor layers, the bonding layer being applied and masked before the reactor layers are loaded with the catalyst. As a result, it is ensured that the efficiency of the catalyst will not be affected during manufacturing. The reactor may be used as a methane and methanol reformer in particular.

Process for manufacturing a microreactor and its use as a reformer

A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.

Method of connecting module layers suitable for the production of microstructure modules and a microstructure module

The invention relates to a microstructure coolerfor an articleto be cooled, whereby the coolerincludes a stack of at least two metal filmsand one base platethat can be brought via a thermal contact surfaceinto thermal contact with the article, the metal filmsand the base plateare joined to one another in a material fit, present in the metal filmsare channelsfor cooling medium, and the channelshave a width in the range of 100 to 2,000 &#x3bc;m, a depth in the range of 25 to 1,000 &#x3bc;m, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channelsin the metal filmsare in the range of 50 to 300 &#x3bc;m, and the base platehas a thickness in the range of 200 to 2,000 &#x3bc;m.

Microstructure cooler and use thereof

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Berlin, Germany

Olaf Kurtz