Infineon Technologies Ag

Olaf Kirsch

Thilo Stolze

Peter Kanschat

Andre Roehrig

A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side and a top side spaced apart from the bottom side in a vertical direction. The at least one semiconductor chip is arranged on the top side. Each one of the first connecting elements has a first end which protrudes away from an insulation carrier of the substrate in a direction perpendicular to the vertical direction. The semiconductor system further includes a connecting system with a number of N&#x2267;1 connectors. A first one of the connectors includes at least two electrically conductive second connecting elements. Each one of the second connecting elements has a first end. The first end of each one of the first connecting elements is electrically conductively connectable to the first end of one of the second connecting elements.

Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector

A power semiconductor module includes a housing element into which one or more connecting lugs are inserted. Each connecting lug has a foot region on the topside of which one or more bonding connections can be produced. In order to fix the foot regions, press-on elements are provided, which press against the end of the connecting lug.

Power semiconductor module, method for producing a power semiconductor module and a housing element for a power semiconductor module

A method for producing a housing part for a power semiconductor module includes providing a connecting lug having a lower end with a foot region, providing a housing having a side wall with a lead-in bevel, and inserting the connecting lug into the lead-in bevel so that the foot region projects inward into an interior of the housing. The method further includes encapsulating at least a portion of the foot region of the connecting lug inserted into the lead-in bevel with a first plastic to produce a positively locking first connection between the connecting lug and the side wall.

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Erwitte, Germany

Olaf Kirsch