Telefonaktiebolaget Lm Ericsson (publ)

Ola Tageman

Per Ligander

Mats Rydström

Ove Persson

Yinggang Li

Mikael Hörberg

Göran Snygg

Anders Martinsson

Kim Nordqvist

Ingmar Andersson

Valter Pasku

Dan Weinholt

The present invention relates to an integrated antenna unit assembly and antenna arrays and antenna packages including the antenna unit assembly. The antenna unit assembly includes a carrier structure, one or more antenna element(s) arranged on a surface of a first edge part of the carrier structure. The integrated antenna unit assembly further includes an integrated circuit (IC) arrangement including one or more circuits mounted on a first surface of a first side of the carrier structure. Further, a first dielectric element mounted on a second surface of the first side of the carrier structure and coupling means arranged to electrically couple the IC to the first dielectric element are also included. The carrier structure of the integrated antenna unit assembly includes a second edge part adapted to be surface mounted on a surface of a second dielectric element.

Packaging for antenna arrays

The present invention relates to a metalized waveguide interface () for providing a galvanically isolated waveguide connection for a propagating signal, between a standardized waveguide () and a, to the standardized waveguide non-compatible, metalized chip-level waveguide (). The metalized waveguide interface () is configured such that a first open-ended quarter wavelength waveguide () and a second open-ended quarter wavelength waveguide () is obtained along the directions dand d, respectively, when the metalized chip-level waveguide () is mounted on the support surface (). The interface is further configured such that third open-ended quarter wavelength waveguide () is obtained between the third surface portion () and the metalized chip-level waveguide () when the metalized chip-level waveguide () is mounted on the support surface (). The interface () further comprises a trench such that a short-circuit half wavelength waveguide () is obtained when the metalized chip-level waveguide () is mounted on the support surface ().

Waveguide interface and non-galvanic waveguide transition for microcircuits

Growing community of inventors

Gothenburg, Sweden

Ola Tageman