Telefonaktiebolaget Lm Ericsson (publ)

International Business Machines Corporation

Ericsson Ab

Ola Ragnar Tageman

Per Ligander

Anatoli Deleniv

Daniel Joseph Friedman

Alberto Valdes Garcia

Duixian Liu

Xiaoxiong Gu

Ove Persson

Christian Wilhelmus Baks

Yinggang Li

Joakim Hallin

Valter Pasku

Pietro Sanchirico

Lars Manholm

Bengt-Erik Olsson

Mats Rydström

Christina Larsson

Thomas Ove Emanuelsson

Dan Rutger Weinholt

Spartak Gevorgyan

Mikael Hörberg

Pierre Filhol

Vladimir Cherman

Sohaib Maalik

The present disclosure relates to a waveguide section () comprising at least one air-filled waveguide conducting tube () having a longitudinal extension (L). Each waveguide conducting tube () has an electrically conducting inner wall () and comprises at least one set of at least two electrically conducting integrally formed protrusions (). Each protrusion () is electrically conducting and comprises a corresponding plate part () that is adapted to form a capacitance (C, C, C, C; C; C) with at least one other plate part in the same set of protrusions () for each set of protrusions (b,), whereby an RF, radio frequency, signal passing via a corresponding waveguide conducting tube () is arranged to be electromagnetically filtered.

Waveguide section and array antenna arrangement with filtering properties

A resonance cavity comprising a first layer of dielectric material having a first dielectric constant and a first thickness, a second layer of dielectric material having a second dielectric constant different from the first dielectric constant and a second thickness, a metal patch arranged between the first and the second layer of dielectric material, and an electromagnetically shielded enclosure having at least one aperture, the electromagnetically shielded enclosure arranged to enclose part of the first and second layers of dielectric material and the metal patch.

Tunable resonance cavity

The present invention relates to a metalized waveguide interface () for providing a galvanically isolated waveguide connection for a propagating signal, between a standardized waveguide () and a, to the standardized waveguide non-compatible, metalized chip-level waveguide (). The metalized waveguide interface () is configured such that a first open-ended quarter wavelength waveguide () and a second open-ended quarter wavelength waveguide () is obtained along the directions dand d, respectively, when the metalized chip-level waveguide () is mounted on the support surface (). The interface is further configured such that third open-ended quarter wavelength waveguide () is obtained between the third surface portion () and the metalized chip-level waveguide () when the metalized chip-level waveguide () is mounted on the support surface (). The interface () further comprises a trench such that a short-circuit half wavelength waveguide () is obtained when the metalized chip-level waveguide () is mounted on the support surface ().

Waveguide interface and non-galvanic waveguide transition for microcircuits

Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.

Wireless communications package with integrated antenna array

A filter arrangement having three or more stacked metallization layers separated by printed circuit board, PCB, layers. Each metallization layer includes an aperture. The filter arrangement has a plurality of via-holes extending though the stacked metallization layers and through the separating Dielectric material layers, whereby the via-holes and the metallization layers delimit a cavity in each Dielectric material layer. The cavities in two consecutive Dielectric material layers being coupled by the aperture in the single metallization layer separating the two consecutive Dielectric material layers. The aperture of a topmost metallization layer being arranged as antenna element. The filter arrangement having a signal interface arranged as a conduit connecting at least one dielectric material layer to an exterior of the filter arrangement.

Filter arrangement

It is provided a waveguide comprising a tubular, electrically conductive waveguide body, the waveguide having a rectangular cross-section. The waveguide further comprises an electrically conductive foil comprising at least one matching portion arranged within the waveguide body, extending along a propagation direction of the waveguide body, and at least one connection portion arranged outside of the waveguide body, for connecting the waveguide to a component, wherein the matching portion of the foil is tapered in a propagation direction of the waveguide and arranged to form a ridge protruding from a sidewall of the waveguide along part of the length of the waveguide, and wherein the connection portion extends outside of the waveguide, in a propagation direction of the waveguide and in the same plane as the matching portion. It is also provided a waveguide arrangement and a method for manufacturing such a waveguide arrangement.

Transition between a tubular waveguide body and an external planar connection portion through a planar matching ridge in the waveguide body

The present disclosure relates to a waveguide transition arrangement () comprising a first ground plane () with a first aperture (), a feed probe () that crosses the first aperture (), a second ground plane () with a second aperture (), and a waveguide resonator part () that has an opening () that faces the second aperture (). The first ground plane () faces the second ground plane () and is positioned between the feed probe () and the second ground plane (), and the second ground plane () faces the waveguide resonator part (). A wall structure () is at least partly arranged between the first ground plane () and the second ground plane () such that a first cavity () is formed in an enclosed volume between them. The first aperture () and the second aperture () are electromagnetically connected to the first cavity (), and where the second aperture () to a second cavity () in the waveguide resonator part () which is electromagnetically connected to a waveguide section () via a third aperture ().

Waveguide transition comprising a feed probe coupled to a waveguide section through a waveguide resonator part

A method () for positioning a first and a second radio antenna comprising the steps of configuring (SI) the first antenna to have a main lobe Land configuring () the second antenna to be a directive antenna having a main lobe L. The method also comprising the steps of transmitting (S) a first alignment signal from the first antenna to the second antenna and positioning (S) the second antenna based on the received first alignment signal, as well as reconfiguring (S) the first antenna to be a directive antenna having an antenna main lobe L, the antenna main lobe Lhaving a more narrow main lobe width than the antenna main lobe L. The method provides a systematic approach to finding optimum antenna positions and corresponding main lobe directions which is especially suited for aligning directive radio antennas in NLOS communication scenarios.

Radio antenna positioning

The present invention relates to a transition arrangement () between a SIW and a waveguide interface (). The SIW comprises a dielectric material (), a first and second metal layer () and a first and second electric wall element () running essentially parallel and electrically connecting the metal layers (). The transition arrangement () comprises a coupling aperture () in the first metal layer () and a third wall element () running between the first and second electric wall elements (). The transition arrangement () further comprises an intermediate transition element () with a first and second main surface (), and a transition aperture () having first and second opening () with corresponding first and second widths (w, w). The transition element () is mounted over the coupling aperture (), the first width (w) exceeding the second width (w) and the transition from the first width (w) to the second width (w) taking place between the first opening () and the second opening () in at least one step (). The second opening () is mounted to the waveguide interface () having an interface opening () being offset relative the second opening (), a front step () being formed.

Transition between a SIW and a waveguide interface

An antenna arrangement comprising a SIW with at least one radiating arrangement. The SIW comprises a dielectric material, a first and second metal layer and a first and second electric wall element running essentially parallel and electrically connecting the metal layers. For each radiating arrangement, the antenna arrangement comprises at least one coupling aperture in the first metal layer, and for each coupling aperture there is a third wall element running between the first and second electric wall elements, across a SIW longitudinal extension (e). For each radiating arrangement, the antenna arrangement further comprises an at least partly electrically conducting antenna component which comprises at least four radiating elements and is surface-mounted on the first metal layer, enclosing at least one coupling aperture. For each radiating arrangement, electromagnetic signals are arranged to be transmitted between said coupling aperture and said radiating elements.

SIW antenna arrangement

A frequency demultiplexer comprising an input part () with an input port (), a low pass filter () and a band-pass filter () with output ports (). The input part (), the low-pass filter () and the band-pass filter () comprise open waveguide sections, and the band-pass filter () comprises gap-coupled resonators (). The input part () and the low-pass filter () connect to the same resonator (), the connection () of the low-pass filter () being at a first maximum distance (L) from a center point (N) of the resonator and the connection () of the output port () being at a second maximum distance (L) from said center point (N) of the resonator. The center point (N) corresponds to a wave node of a wavelength &#x3bb;, where &#x3bb;=2d/M, M is a positive integer value and d is the shortest end-to-end distance along the resonator.

Frequency demultiplexer

A duplex unit allowing simultaneous transmission and reception of microwave signals on at least partly overlapping frequency bands, comprising an interference canceller unit and a control unit, the duplex unit being arranged to receive a transmit signal and to output a first part of the transmit signal at an antenna port, the duplex unit further being arranged to receive a receive signal comprising a payload signal at the antenna port, and to output a combination of the receive signal and a filtered transmit signal as an interference suppressed receive signal of the duplex unit.

Duplex unit

A transition () from microstrip to waveguide, the waveguide comprising first () and second (&#x2033;) interior surfaces connected by side walls () whose height (h, h, h) is the shortest distance between said interior surfaces, and a microstrip structure () extending into the closed waveguide (). The microstrip structure comprises a microstrip conductor () on a dielectric layer arranged on said first interior surface. The microstrip conductor () comprises and is terminated inside the closed waveguide by a patch (). The height (h) of the side walls () along the distance that the microstrip conductor () extends into the closed waveguide () being less than half of the greatest height (h) beyond the microstrip structure's protrusion into the closed waveguide ().

Transition between a microstrip protruding into an end of a closed waveguide having stepped sidewalls

An electronic circuit () which comprises a flat circuit board with a layer of a non-conducting material with opposing first and second main surfaces, with a central ground pad arranged on a part of the first main surface and a ground plane arranged on the second main surface which protrudes beyond the central ground pad. There is a flat no leads package () arranged on the central ground pad. The flat no leads package () comprises a central plate () with protrusions () which protrude beyond the central ground pad and overlap the ground plane (). The electronic circuit () comprises a grounding network () connected to the ground plane () and to at least one protrusion (), thereby connecting the at least one protrusion () electrically to the ground plane ().

Growing community of inventors

Gothenburg, Sweden

Ola Ragnar Tageman