Samsung Electro-mechanics Co., Ltd.

Hyundai Mobis Co., Ltd.

Other

Lg Electronics Inc.

Noroobee Chemical Co., Ltd.

Daihan Bee Chemical Co., Ltd.

Ok Tae Kim

Myung Sam Kang

Sung Keun Noh

Kil Yong Yun

Jeong Woo Park

Yong Gi Chun

Sung Ho Cho

Mi Sun Hwang

Min Jung Cho

Seung Pyo Hong

Yong Chul Lee

Jung Hwan Lee

Seon Ha Kang

Dong Woo Kang

Ki Tae Kim

Dong Young Kim

Hoon Kwan Joo

Gil Yong Shin

Jae Boem Ahn

Young-Ho Cho

Seung Wook Baek

Kang-Moon Jin

Mi Hye Lee

Jae-Beom Ahn

Cheol-Hee Cho

Jeong Kwon Byeon

Soo Keun Lee

A device for forming seam of elbow duct is provided, and the device for forming seam of elbow duct that molds a lockseam by bending a flange of one pair of adjacent unit members, of a plurality of unit members constituting the elbow duct, including a base that supports a lower portion of the one pair of unit members; an elevating part that moves the base up and down; an angle adjustment part that adjusts a supporting angle of the base; a fixing chuck that supports an inner circumferential surface of a connecting portion of the one pair of unit members; a rotating part that rotates the fixing chuck; and a forming part that bends the flange of the one pair of unit members in a state where the flange is in contact to each other, to form the seam.

Seam forming apparatus for elbow duct

The present disclosure relates to a duct cutting and forming apparatus for elbow duct manufacturing machine, the apparatus including a rotation housing that is provided with a seating groove in a first direction; an eccentric housing that is provided with a cutting roller and a forming roller at both ends, and that is slidably seated inside the seating groove; a rotation drive for applying rotation driving force to the rotation housing; and an eccentric drive for applying driving force for reciprocating the eccentric housing, wherein the eccentric drive reciprocates the eccentric housing as it rotates in both directions within a range not exceeding 180 degrees.

Duct cutting-and-forming device for elbow duct manufacturing device

The present disclosure relates to an apparatus for forming flange of circular duct, and the apparatus for forming flange of circular duct according to the present disclosure includes a forming jig that is disposed to surround an outer circumference of a lower end portion of a duct, and that has a forming groove on a surface facing the duct; a support that supports a lower end of the duct below the forming jig; a height adjustor that adjusts height of the support; and a forming unit that hits an inner circumference of the lower end portion of the duct to form a flange having a shape corresponding to the forming groove of the forming jig on the lower end portion of the duct, wherein the forming groove includes a first forming surface formed on the surface facing the duct, and a second forming surface additionally extended from a distal end portion of the first forming surface, and the height adjustor is configured to adjust a relative position of the support with respect to the forming jig such that the flange is formed only on the first forming surface or formed on the first forming surface and the second forming surface.

Apparatus for forming flange of circular duct

The present invention relates to a primerless base painting composition for parts of a vehicle comprising a resin component including a non-chlorinated modified polyolefin resin and an acrylic resin; a pigment; additives; and a solvent selected from an aqueous solvent and an oil solvent, a kit comprising the same, painted parts of a vehicle comprising the same, and a method for painting and varnishing parts of a vehicle using the same.

Primerless base painting composition for parts of vehicle, kit comprising the same, painted parts of vehicle comprising the same and method for painting and varnishing parts of vehicle using the same

Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Method of manufacturing printed circuit board

A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.

Method of manufacturing a printed circuit board having metal bumps

A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a metal carrier; forming a barrier layer on the metal carrier including the recess; forming an upper circuit layer on the barrier layer, the upper circuit layer including the metal bump charged in the recess and a circuit pattern; preparing an insulating layer, and transferring the upper circuit layer to the insulating layer; and removing the metal carrier and the barrier layer.

Disclosed herein is an aqueous coating composition for plastic automotive interiors, including 1) a component selected from the group consisting of aqueous polyurethane resins, aqueous acrylic resins, and mixtures thereof, 2) an aqueous polyurethane resin having a hydroxyl group, 3) a micronized silica dispersant having an average particle size of 10&#x2dc;30 &#x3bc;m, 4) a polyethylene paraffin wax dispersant having an average particle size of 30&#x2dc;100 nm, 5) a polysiloxane surface controlling agent, 6) a polyoxyethylene sorbitan monooleate stabilizer, 7) capsulated aromatic particles, and 8) a trifunctional hexamethlylenediisocyanate curing agent having a hydrophilic group.

Aqueous coating composition for plastic automotive interiors

In-line type electron gun in a color cathode ray tube including a pre-focusing lens part having at least two electrodes for focusing electron beams, a main lens part having two, or more than two electrodes for focusing the electron beams onto a screen, and at least one electrostatic field controlling electrode in the electrodes of the main lens part having a center electron beam pass through hole and two outer electron beam pass through holes, wherein each of the outer electron beam pass through holes has a form a circular hole and a rectangular hole are combined therein, the rectangular hole having a height 'V ' greater than a vertical diameter 'V ' of the center beam pass through hole of the electrostatic field controlling electrode, thereby permitting an excellent focusing and improving assembly work.

In-line type electron gun in cathode ray tube

Growing community of inventors

Yongin-si, South Korea

Ok Tae Kim