Samsung Electro-mechanics Co., Ltd.

Ohk Kun Lim

Yeong Gyu Lee

Suk Kee Hong

Heung Woo Park

Seung Heon Han

Yoon Shik Hong

Young Nam Hwang

Min Suk Oh

Seung Hee Suh

Chang Su Park

Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.

Optical modulator module package using flip-chip mounting technology

A micro-electro-mechanical system (MEMS) package having a metal sealing member is disclosed. The MEMS package is formed by forming a metal layer on a substrate by patterning so that the metal layer surrounds an MEMS element provided on the substrate; joining a lid to the metal layer; providing a side sealing member on a side surface of the substrate; and covering the lid and the substrate with a metal sealing member, thus hermetically sealing the MEMS element from the external environment.

Micro-electro-mechanical system (MEMS) package having metal sealing member

The present invention relates, in general, to a light modulator having a variable blaze diffraction grating and, more particularly, to a light modulator having a variable blaze diffraction grating, in which a diffraction member rotates due to piezoelectric force so as to incline a reflective surface.

Light modulator having variable blaze diffraction grating

Disclosed herein is a light modulator module package, which is advantageous because a size of the module package is minimized and heat is efficiently dispersed while the optical properties of a light modulator device are maintained.

Growing community of inventors

Gyeonggi-do, South Korea

Ohk Kun Lim