Camtek Ltd.

Ohad Shimon

Shimon Koren

Carmel Yehuda Drillman

Moshe Edri

Mordi Dahan

Gil Perlberg

An inspection system and method are presented for edge and bevel inspection of a semiconductor structure using and an optical system defining: a tangential imaging providing back-light tangential illumination propagating along a tangential illumination path with respect to a contour outline of a contour region of an edge of the structure and substantially along a detection path of a tangential imaging sensor unit which detects at least a part of said back-light tangential illumination and generates image data indicative of a tangential image of the contour outline to enable detection of defect data of the edge, and at least dark-field imaging setup directing dark-field illumination towards the contour region along at least one dark-field illumination path and providing collection of scattering of a response of the contour region to the dark-field illumination, to enable detection of a dark-field image indicative of location of defects along said profile of the edge.

Inspection system for edge and bevel inspection of semiconductor structures

The present disclosure relates to a novel semiconductor edge and bevel inspection tool system of a wafer comprising a first illumination setup, an imaging sensor unit, and a second illumination setup. At least a portion of the second illumination radiation is configured for interacting with at least a portion of the wafer edge and bevel region surface. The second illumination setup has different radiation parameters than the first illumination setup. The first and the second illumination radiations have substantially opposite directions.

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Ramat Yishai, Israel

Ohad Shimon