Samsung Electronics Co., Ltd.

Oh Soo Kwon

Jin Hee Yoon

Jun Suk Kwak

Dong Keun Park

Jeong Pyo Kim

Khee Park

Gi Y Jeon

The MRI apparatus includes a main magnet forming a static magnetic field in a bore, and a gradient coil assembly which forms a magnetic field gradient in the static magnetic field and includes a plurality of shim trays arranged therein at a predefined interval and at least one first shim token provided between the shim trays.

Magnetic resonance imaging apparatus and manufacturing method thereof

A magnetic resonance imaging (MRI) apparatus includes a coil assembly including a superconductive magnet; and a helium container configured to accommodate a helium in a liquid state and the coil assembly. The helium container includes a partition wall configured to surround a portion of an outer circumference of the coil assembly, and the helium in the liquid state is accommodated in a first space formed between the partition wall and the coil assembly.

Magnetic resonance imaging apparatus

An ultrasound probe and a method for manufacturing the same are provided. More particularly, a one-dimensional or two-dimensional ultrasound probe having a multi-element-type piezoelectric material is easily manufactured by inserting a flat wire in a backing material, wherein the flat wire is used as a signal cable to supply electrical signals, enabling easy and simple arrangement of piezoelectric units as well as the signal cable.

Ultrasound probe and manufacturing method thereof

A chip-lifetime testing instrument for semiconductor devices which can detect defective chips by testing the performance and electrical lifetime of the chips in manufacturing process of the semiconductor devices, so that the manufacturing cost can be reduced and unnecessary processes for packaging of defective chips can be avoided, thereby reducing the necessary space for the set-up of the testing instrument.

Chip-lifetime testing instrument for semiconductor devices

A semi-conductor package having an insulator formed by a supporting portion, a mounting portion and connecting members, and a layer of electrically conductive material on the insulator in a pattern forming a pad and inner leads connected to the pad by supporting bars. A chip is attached on the pad, and the inner leads are wire-connected to the chip. The pad is vertically offset from the inner leads and the chip is supported in recessed fashion on the pad which shortens the length of the connecting wires whereby the wire-connecting efficiency and the structural stability are improved.

Growing community of inventors

Seoul, South Korea

Oh Soo Kwon