Pacesetter, Inc.

Ofer Rosenzweig

Dino Bortolin

Wisit Lim

Avi Bilu

Alex C Soriano

Reza Imani

Xiangqun Chen

Asghar Dadashian

Mitch Goodman

Brett Villacencio

Reza Shahandeh

Armando M Cappa

Kavous Sahabi

Christopher R Jenney

Arees Garabed

Evan Sheldon

Rodney J Hawkins

Alexander Robertson

Sean Portune

Adam Evard

A blade for a cutting instrument includes a handle, a body, and at least three cutting edges along the body. The body has first and second sides extending along a longitudinal center axis. The body has a proximal end at the handle and a distal tip remote from the handle. The at least three cutting edges are oriented at corresponding angles with respect to the longitudinal center axis and are asymmetrically distributed with respect to the longitudinal center axis.

Cutting instrument with asymmetric blade

The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.

Systems and methods for manufacturing header subassembly

A header-less implantable medical device, system and method are provided. The device includes an electronics module including circuitry, a battery, a receptacle assembly having an interior chamber and a receptable inlet configured to receive a lead connector assembly. A device housing has a case body that includes side walls and a peripheral edge that defines a single common chamber. The electronics module, battery and receptacle assembly are provided within the single common chamber. A connector opening is provided in the case body and joined to the receptacle inlet to form a passage through the case body into the interior chamber of the receptacle assembly.

Header-less implantable medical device

A device and method for manufacturing an implantable cardiac monitor device are provided. The method joins a feed-through assembly to a device housing having electronic components therein. The feed-through assembly includes conductors having distal ends connected to the electronic components and has proximal ends projecting from the feed-through assembly. The method assembles a header having a sensing electrode and an antenna embedded within a non-conductive header body. The electrode and antenna includes corresponding interconnection plates. The header body includes a housing mounting surface that includes at least one passage aligned with an interconnect cavity that includes the interconnection plates. The header body further includes a window exposing the interconnect cavity and interconnect regions. The method further directs the proximal ends of the conductors through the passage to align with the interconnect regions and secures the proximal ends and the interconnect regions to one another through the window.

Method for manufacturing implantable device header with embedded sensor and antenna

A pulse generator comprises a header connector assembly coupled with a housing. The header connector assembly includes a connector assembly and a header enclosing the connector assembly. The connector assembly includes an electrically insulative segment, a first electrically conductive segment, and a second electrically conductive segment axially spaced apart from the first electrically conductive segment by the electrically insulative segment. Each electrically conductive segment includes a connector ring, a spring housing and a spring supported by the spring housing. The connector ring and spring housing are in electrical communication with each other. The electrically insulative segment includes an insulator ring that is positioned between the first and second electrically conductive segments. The insulator ring includes a first end and a second end axially opposite the first end. The first end includes a first recess that opens axially and receives therein a portion of the first electrically conductive segment.

Connector for use in injection molded header of implantable pulse generator

Implantable device header with embedded sensor and antenna

The present disclosure provides medical devices and methods of manufacturing medical devices wherein the medical device includes at least one bonding surface that has been roughed by laser etching to increase its surface area and improve its bonding characteristics. In many embodiments, the medical device is an implantable medical device that includes a hermetically sealed metallic housing that is bonded to a prefabricated non-metallic header. The hermetically sealed metallic housing includes at least one surface that has been subjected to a laser etching and roughening process to increase its surface area and improve its bonding characteristics. The laser etched surface may include spots created in a non-overlapping honeycomb-type pattern that may additionally include a series of spikes protruding therefrom to further improve bonding characteristics.

Implantable medical devices including a laser etched surface in bonded areas

Disclosed herein is an implantable electronic device. The device has a housing and a header connector assembly coupled to the housing. The header connector assembly has a connector assembly and a header enclosing the connector assembly. The connector assembly has a subassembly including an electrically conductive component at least partially residing within a first material that is provided about the electrically conductive component. The header has a second material that is provided about the connector assembly and the subassembly subsequent to the first material setting up about the electrically conductive component.

Implantable electronic device employing fused thermoplastic-conductor subassembly and method of manufacturing the subassembly and the device

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Chatsworth, CA, United States of America

Ofer Rosenzweig