Qualcomm Incorporated

Ofer Markish

Alon Yehezkely

Elimelech Ganchrow

Iddo Diukman

Jorge Myszne

A printed millimeter wave dipole antenna and techniques for designing such an antenna are disclosed. In one embodiment, the dipole antenna comprises: a signal wing and at least one ground wing for propagating signals in a millimeter wave band; and an unbalanced feeding structure directly coupled to the signal wing. The unbalanced feeding structure is boarded by a plurality of escorting vias to ensure equipotential grounds.

Techniques for designing millimeter wave printed dipole antennas

A millimeter-wave radio frequency (RF) module is provided. The RF module includes a multilayer substrate having at least a front layer, a back layer, a plurality of middle layers, a first ground layer, and a second ground layer, wherein the first ground layer includes a graded-ground plane having a pair of non-overlapping ground lines connected at a single connection point through a graded connection, and wherein the second ground layer includes a double graded-ground plane having a pair of overlapping ground lines connected at a single connection point through a graded connection, wherein the first ground layer and the second ground layer provide a reference ground to a transmission line included in the multilayer substrate.

Graded-ground design in a millimeter-wave radio module

A triple-band antenna for transmitting and receiving low-frequency band signals and high-frequency band signals. The triple-band antenna includes a printed antenna having two wings for transmitting and receiving low-frequency signals; and an antenna array including a plurality of radiating elements being printed on one of the wings of the printed antenna, wherein the antenna array transmits and receives the high-frequency band signals, wherein one of the wings of the printed dipole is a ground for the antenna array.

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Emek Hefer-Beerotaim, Israel

Ofer Markish