Applied Materials Israel Limited

Applied Materials, Inc.

Ofer Adan

Yoram Uziel

Ishai Schwarzband

Roman Kris

Shimon Levi

Yakov Weinberg

Ran Goldman

Dhananjay Singh Rathore

Olga Novak

Itay Zauer

Ron Naftali

Haim Feldman

Juergen Frosien

Alon Litman

Moshe Amzaleg

Igor Krivts (Krayvitz)

Doron Korngut

Israel Avneri

Moshe Langer

Ofer Shneyour

Niranjan Ramchandra Khasgiwale

Ori Shoval

Ron Bar-or

Yuval Yahav

Ram Peltinov

There is provided a method and a system configured to obtain metrology data Dinformative of a plurality of structural parameters of a semiconductor specimen, obtain a model informative of a relationship between at least some of said structural parameters and one or more electrical properties of the specimen, use the model and Dto determine, for at least one given electrical property of the specimen, one or more given structural parameters among the plurality of structural parameters, which affect the given electrical property according to an impact criterion, and generate a recipe for an examination tool, wherein the recipe enables a ratio between a first acquisition rate of data informative of the one or more given structural parameters, and a second acquisition rate of data informative of other structural parameters of the plurality of structural parameters, to meet a criterion.

Prediction of electrical properties of a semiconductor specimen

A system, computer program product and a method for detecting manufacturing process defects, the method may include: obtaining multiple edge measurements of one or more structural elements after a completion of each one of multiple manufacturing phases; generating spatial spectrums, based on the multiple edge measurements, for each one of the multiple manufacturing phases; determining relationships between bands of the spatial spectrums; and identifying at least one of the manufacturing process defects based on the relationships between the bands of the spatial spectrums.

Method, computer program product and system for detecting manufacturing process defects

A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.

Technique for measuring overlay between layers of a multilayer structure

A method and a system for moving a substrate, the system includes a chamber, a chuck, a movement system that is positioned outside the chamber, a controller, an intermediate element, at least one sealing element that is configured to form a dynamic seal between the intermediate element and the chamber housing. The movement system is configured to repeat, for each region of the substrate out of a plurality of regions of the substrate, the steps of: rotating the chuck to position a given portion of the region of the substrate within a field of view that is related to an opening of the chamber housing; and moving the chuck relation to the opening to position additional portions of the region of the substrate within the field of view that is related to the opening.

Method and system for moving a substrate

There may be provided an evaluation system that may include spatial sensors that include atomic force microscopes (AFMs) and a solid immersion lens. The AFMs are arranged to generate spatial relationship information that is indicative of a spatial relationship between the solid immersion lens and a substrate. The controller is arranged to receive the spatial relationship information and to send correction signals to the at least one location correction element for introducing a desired spatial relationship between the solid immersion lens and the substrate.

Evaluation system and a method for evaluating a substrate

A non-transitory computer readable medium, a system and a method. The method may include obtaining, by an image obtaining module, an image of a measurement site, the measurement site comprise the feature, the image of the measurement site comprises an image of the feature; processing, by an image processor, the image of the measurement site to provide an artificial image, the artificial image comprise a artificial image of an artificial feature, the artificial feature differs from the feature; measuring a parameter of the artificial feature to provide a measurement result, wherein the measuring comprises applying a measurement algorithm that is inadequate for measuring the parameter of the feature; and determining a value of the parameter of the feature in response to the measurement result.

System, method and computed readable medium for evaluating a parameter of a feature having nano-metric dimensions

An evaluation system that includes a miniature module that comprises a miniature objective lens and a miniature supporting module; wherein the miniature supporting module is arranged, when placed on a sample, to position the miniature objective lens at working distance from the sample; wherein the miniature objective lens is arranged to gather radiation from an area of the sample when positioned at the working distance from the sample; a sensor arranged to detect radiation that is gathered by the miniature objective lens to provide detection signals indicative of the area of the sample.

System and method for inspecting a sample using landing lens

A method, a system and a computer readable medium are provided. The method may include obtaining or receiving first area information representative of a first area of a first layer of an inspected object; wherein the inspected object further comprises a second layer that comprises a second area; wherein the second layer is buried under the first layer; directing electrons of a primary electron beam to interact with the first area; directing electrons of the primary electron beam to interact with the second area; generating detection signals responsive to electrons that were scattered or reflected from at least one of the first and second areas; and determining at least one spatial relationship between at least one feature of the first area and at least one feature of the second area based on the detection signals and on the first area information.

High electron energy based overlay error measurement methods and systems

Growing community of inventors

Rehovot, Israel

Ofer Adan