Technische Universiteit Eindhoven

Oded Raz

Harmen Joseph Sebastiaan Dorren

Pinxiang Duan

Teng Li

Elbertus Smalbrugge

An optical interconnect device is provided that includes a first vertical cavity of surface emitting laser (VCSEL), connected in parallel with a second VCSEL, an optical coupler that is configured to direct the light output from the first VCSEL and the second VCSEL to a single optical fiber, where a common connection of each VCSEL is controlled using a MOSFET/inverter, where in normal operation only one of the first VCSEL or the second VCSEL is enabled, where a common connection of each VCSEL is not directly connected to a ground, and a microcontroller that is configured to switch output from the first VCSEL to the second VCSEL in the event of failure by the first VCSEL, where a failure of the first VCSEL does not result a communication in link failure.

One plus one redundant optical interconnects with automated recovery from light source failure

A completely digital optical receiver is provided. The optical receiver includes a photodiode configured to provide a photodiode output responsive to an on-off keyed (OOK) optical input. Two or more digital inverters connected in series with each other are configured to receive the photodiode output and provide an amplified digital output. A digital clock and data recovery (CDR) circuit receives the amplified digital output and provides a clock output and a data output. A digital photodiode discharging circuit is connected to the photodiode and controlled by the clock output of the CDR circuit.

Fully digital CMOS based optical receiver

A method and device for interconnecting stacked die surfaces with electrically conductive traces is provided that includes bonding, using a first layer of a photoresist compound, a second die () on top of a first die (), heating the first layer above a pyrolyzation point of the photoresist compound, where the photoresist compound transitions to a stable layer, depositing a second layer of the photoresist compound (PR), using lithography, from a top surface of the first die () to a top surface of the second die (), heating the second photoresist compound layer to a liquid state, where the liquid photoresist compound forms a smooth convex bridge between the first die () top surface and the second die () top surface, and depositing an electrically conductive layer on the smooth convex bridge, where an electrically conductive trace is formed between the first die () top surface and the second die () top surface.

Growing community of inventors

Eindhoven, Netherlands

Oded Raz