Telefonaktiebolaget Lm Ericsson (publ)

Tyco Electronics Svenska Holdings Ab

Tyco Electronics Services Gmbh

Finisar Corporation

Odd Steijer

Paul Asger Eriksen

Hans-Christer Moll

Jan-&angst;ke Engstrand

Hans Magnus Emil Andersson

Bengt Olof Lindstr&ouml;m

Christian Vieider

Goran Palmskog

Olle Larsson

Jan-ANGke Engstrand

Magnus Andersson

H&aring;kan Elderstig

Christer Moll

Andrei Kaikkonen

Theron Jones

Nicolae Chitica

Marek Grzegorz Chacinski

Lars-Göte Svenson

Stefan Lindgren

Sven R Sjolinder

Hangkan Elderstig

Jan-Ake Engstrand

Ylva Backlund

Lennart Lundqvist

Jürgen Hauenschild

Bengt O Lindstrom

Ivan Jonas

Lars-Goete Svenson

Lennart Bäcklin

Hans Moll

Elisabeth Källén

Ulf Holm

Pia Tinghag

Jan ANGke Engstrand

Mats Janson

Åsa Johansson

Lars Erik Pontus Lundstr&ouml;m

B&ouml;rje Rosborg

Phillip Peter Laubert

Ulf Sven Olof Holm

David Nidelius

Josef Bakszt

Mangus Andersson

An integrated optical transceiver, comprising a laser component, comprising an array of VCSEL diodes formed on a laser diode substrate; a laser driving component, comprising laser diode driving circuitry formed on a laser driving circuitry substrate; a photodiode component, comprising an array of photodiodes formed on a photodiode substrate; and a photodiode driving component, comprising photodiode driving circuitry formed on a photodiode driving circuitry substrate; a first heat sink comprising a connected piece of material to transport excess heat away from the integrated optical transceiver and connected to both the laser and photodiode driving components; and an electrically insulating material separating the photodiode substrate from the first heat sink and being air or dielectric material with a relative dielectric constant &#x3b5;&#x3c;10, wherein the electrically insulating material provides a gap having an effective electrical distance of at least 80 &#x3bc;m between the photodiode substrate and the first heat sink.

Integrated optical transceiver

An optoelectronic module is disclosed. The optoelectronic module comprises an optical connector, a contact, an opto-electric assembly, and a casing. The opto-electric assembly has a carrier optically connected to the optical connector by a flexible optical fiber and electrically connected to the contact by a flexible cable. The casing at least partially encloses the opto-electric assembly, the optical connector, and the contact. An inner surface of a wall of the casing is attached to the carrier in a thermally conductive manner.

Optoelectronic module with improved heat management

An interposer comprising a substrate having at least a top surface and a bottom surface, the top and bottom surfaces being substantially parallel; at least one series of bottom cavities on the bottom surface; at least one expansion cavity contiguous with the at least one series of bottom cavities, the at least one expansion cavity being larger than each of the bottom cavities; a perimeter defined on the bottom surface around the bottom cavities; at least one alignment fiducial on the top surface for cooperating with a corresponding fiducial on the detachable optical interface to optically couple an optical conduit attached to the detachable optical interface with at least one optical device; and the at least one optical device mounted to the substrate on at least a portion of the perimeter, the optical device configured to emit a diverging light beam or receive a non-diverging light beam.

Interposer with opaque substrate

The present disclosure relates to an optical module comprising a carrier substrate including first electrical connection terminals on a first surface and second electrical connection terminals on a second surface electrically connected to the first electrical connection terminals. The second electrical connection terminals are connectable to a circuit carrier. The optical module further comprises an optically transparent carrier including first electrical connection terminals, and an optical element electrically connected to the optically transparent carrier. The optically transparent carrier is mechanically attached and electrically connected to the carrier substrate trough corresponding first electrical connection terminals, and the optical element is connected on a first surface of the optically transparent carrier and is adapted to emit/receive light through the optically transparent carrier to/from an optical coupling element facing a second surface of the optically transparent carrier opposing the first surface.

Miniaturized high speed optical module

Disclosed is a carrier assembly for and a method of manufacturing an optical device. The method comprises providing a silicon substrate; attaching a number of optical dies on the silicon substrate to form an optical device carrier assembly; providing a corresponding number of through holes in the silicon substrate to permit the passage of light therethrough and further providing guide holes in the silicon substrate to present means for passive alignment of an external optical connection; and dicing the optical device carrier assembly to form individual optical devices. Preferably, the step of attaching a number of optical dies comprises using self-alignment of solder bumps using gaseous flux, the through holes are dry etched into the silicon substrate, and/or the volume between the optical die and silicon substrate is filled with a transparent polymer. Preferably, the transparent polymer is silicone rubber or epoxy. Preferably, the optical dies have a polymer mass to assist the heat transfer to the silicon substrate.

Self-aligned silicon carrier for optical device supporting wafer scale methods

Broadly speaking, disclosed is a carrier assembly for an optical device, the carrier assembly comprising in combination: a glass substrate with an optical die thereon; and a silicon carrier attached to the glass carrier. During manufacture, a number of optical dies can be attached on the glass substrate using self-alignment of AuSn solder bumps using gaseous flux at about 300 deg C. The glass carrier can be mounted to the silicon carrier to form an optical device carrier assembly comprising micromechanical guide holes to facilitate a optical fiber connection, using self-alignment of SnAg solder bumps using gaseous flux at about 250 deg C. Each individual optical device can be tested at a wafer scale. The resulting optical device assembly can be diced to form individual optical devices having a carrier assembly that exhibits the traits of both a silicon carrier and a glass carrier.

Self-aligned carrier assembly for optical device supporting wafer scale methods

An optocasule unit for an optohybrid assembly (), said capsule unit comprising a lower casing part () and a compatible upper cover part () which together form, at one end () thereof, an integral receptacle section for obtaining an optomechanical interface and receiving and detachably holding therein an optical connector with at least one external optical fiber. A central section () of the lower casing part () has a cavity () for receiving, in a form-closed manner, a ferrule () of the optohybrid assembly (). The lower casing part () has, at a second end thereof, a base plate () for supporting a substrate () having at least one optochip () and a proximal end of at least one primary optical fiber () mounted thereon. The cover part () also has a section () covering the substrate () and at least a portion of the base plate () of the lower part. The invention is also addressed to the lower casing part () of the optocapsule unit for enclosing an optohybrid assembly () therein, and to an optoelectronic module () comprising the capsule unit with an optohybrid assembly enclosed therein.

Optocapsule unit for an optohybrid assembly, a lower casing part of such an optocapsule unit, and an optoelectronic module comprising said optocapsule unit and an optohybrid assembly

The present invention relates to a spring clip for holding the connection sides of optical units in contact with one another, said optical units including guide pins and optical coupling surfaces. The clip includes a main part from which hooked members project out generally at right angles. A first and a second hooked member are adapted to snap firmly over a first optical unit, whereas a third hooked member is adapted to urge an optical connection side on a second optical unit against an optical connection side on the first optical unit.

Spring clip

A plastic encapsulated optomodule is provided which includes a leadframe, an optoelectric component, an electric component, and an optical connection interface integrated in the capsule. The electric component is connected electrically to the leadframe. The electric component and the optoelectric component are mutually connected electrically and the optoelectric component and the integrated connection interface are connected together via at least one optical waveguide. The electric component is provided on a first part of the leadframe and electric contact surfaces ( ) are provided on leads ( and ) in the leadframe ( ). The optoelectric component is provided on a second part of the leadframe and the optical connection interface arranged on an optodevice is connected to a third part of the leadframe. The optodevice is aligned by alignment elements provided on the leadframe and the leadframe includes alignment elements that conform with corresponding alignment elements on a plastic-encapsulation mold tool.

Optomodule

The present invention relates to an angled opto-mechanical connector ( ) and to a manufacturing process for the same. The connector ( ) comprises a fixture ( ) with straight and parallel grooves ( ) of two sizes running on the upper side of the fixture ( ) from a first fixture side ( ) to a second fixture side ( ). A lid ( ) is fastened above the fixture ( ). Fibre ends ( ) of optical fibres ( ) are placed in the capillaries which are formed between the smaller grooves ( ) of the fixture and the lid ( ) in such a way that they stick out through the side of the fixture ( ). A plastic capsule ( ) encloses the fixture ( ), the lid ( ) and the fibres ( ) completely or partially. The fibres ( ) stick out from the plastic capsule ( ) in a direction separated from that defined by the grooves of the fixture. The connector ( ) can also have an opto-mechanical interface of the above mentioned type at its other end ( ).

Angled opto-mechanical device

In encapsulating an optocomponent, a leadframe is used for the electrical connection of the component, the leadframe having a flag, to which the main body of the optocomponent is attached. The flag is located asymmetrically at an outer edge of the leadframe and is, in the encapsulating operation, placed close to a sidewall in a mold cavity in a mold. In this way, an optical interface of standard type can be obtained in the wall of the capsule. Further, the flag is flexibly attached, by zigzag-shaped bridges, to other portions of the leadframe so that the flag and thus the optocomponent will have a possibility to be resiliently and flexibly displaced a little at the positioning thereof in the mold cavity in the mold in relation to the other portions of the leadframe, in particular to its outer frame portions and bridge portions. By designing the zigzag-shaped bridges with a suitably adapted width and thickness a controlled elastic restoring force acting on the flag can be obtained and thus on the optocomponent so that it can be pressed and firmly retained in engagement with a positioning device for the optocomponent.

Leadframe for an encapsulated optocomponent

In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity in a mold half and the optocomponent is placed in the cavity in the mold, so that the guide pins are engaged in the guide grooves and ar accurately inserted therein. To achieve this effect, a resilient or elastic force such as from plunger is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity in the mold. The elastic force can also be obtained directly from a leadframe, to which the optocomponent is attached for electrical connection, or from a small elastic part placed in the cavity in the mold, this part then remaining in the capsule.

Injection of encapsulating material on a optocomponent

In manufacturing an encapsulated optocomponent, the optocomponent is embedded in a plastics material. The optocomponent has guide grooves on one of its surfaces in which guide pins are to extend so that the encapsulated optocomponent will obtain an optical interface of standard type. For the encapsulating operation guide pins are placed in a mold cavity of a mold half and the optocomponent is placed in the cavity of the mold, so that the guide pins are engaged in the guide grooves and are accurately inserted therein. To achieve this effect, a resilient or elastic force, such as from a plunger, is applied to the other side of the optocomponent, so that it is pressed with some force against the guide pins. The cavity in the mold is then closed by placing a second mold half on top after which the encapsulating material can be introduced in the closed cavity of the mold. The elastic force can also be obtained directly from a leadframe, to which the optocomponent is attached for electrical connection, or from a small elastic part, placed in the cavity of the mold.

Injection of encapsulating material on an optocomponent

An encapsulated optocomponent has an optocomponent assembly having an optical interface at one side, which has guide pins for positioning a connected optical component or optical connector. The assembly is attached to the outermost portion of a flexible tongue, which is an integral part of a dielectric carrier such as a polymer carrier. On or inside the carrier and the tongue thereof electrical conductive paths are arranged which are connected to the optoassembly and to electrical driver circuits in a driver circuit assembly, so that the carrier also has the function of a conventional lead frame. The entire device is molded into encapsulating plastic material. In the molding operation the positioning of the optoassembly in an accurately determined position and the retainment thereof in this position is facilitated by the flexibility of the tongue, not being affected for example by the fact that an injected encapsulating material may possibly displace the significantly larger driver circuit assembly and its attachment area on the carrier. This construction can also allow that only the optoassembly is encapsulated, the driver circuit assembly being protected in some other way, so that the flexible tongue is exposed. This design can facilitate the accurate positioning of the optocomponent assembly on a circuit board.

Encapsulation of transmitter and receiver modules

The present invention relates to a manufacturing method for an opto-mechanical connector (,) and to the connector itself. The invention includes that a fixture (,) is manufactured with straight and parallel grooves (,) running on the upper side of the fixture (,) from a first fixture side (,) to a second fixture side (,), and which grooves (,) are intended partly for optical fibers and partly for guide pins. A lid (,) is attached above the fixture (,), whereafter optical fibers (,) from, for example, a fiber ribbon cable (,) are introduced into the grooves (,) intended for the fibers from the first fixture side (,) so that the fiber ends (,) extend out through the second fixture side (,). Guide pins (,) are furthermore introduced into the grooves (,) intended for the guide pins. The structure obtained (fixture (,), lid (,), fiber ends (,) and guide pins (,)) is completely or partially enclosed by a plastic capsule (,).

Opto-mechanical device

Growing community of inventors

Bromma, Sweden

Odd Steijer