Samsung Electronics Co., Ltd.

Hewlett-packard Development Company, L.p.

O-hyun Beak

Keon Kuk

Eun-bong Han

Yeon-kyoung Jung

Young-dae Ko

Il-ju Mun

Hyeon-hyang Kim

Woon-bae Kim

Tae-Kyun Kim

Youn-gun Jung

Sung-Joon Park

Jae-sik Min

Jin-seung Choi

Kyong-il Kim

Young-chul Ko

Young-ung Ha

Jun-hee Lee

Su-in Lee

Young-hoon Han

Soo-hwan Bae

Eun-Bong Han

Young-Dae Ko

Il-Ju Mun

Su-In Lee

A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

Semiconductor package and method of manufacturing the same

An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.

Object forming apparatus and controlling method thereof

An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

EMI shielding structure and manufacturing method therefor

A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof

A surface heating type heating unit for a fixing device, and a fixing device and an image forming apparatus including the same. The surface heating type heating unit includes a planar heating element on an outer circumferential surface of a supporter having cylindrical shape, a power feeding terminal at each end of the supporter, and a connector disposed between the planar heating element and the power feeding terminal. The connector is formed on a first region on the power feeding terminal, and includes an adhesive material for adhering the planar heating element and the power feeding terminal, and a conductive material formed on a second region of the power feeding terminal excluding the first region.

Surface heating type heating unit for fixing device, and fixing device and image forming apparatus including the same

A method and apparatus of dot counting. The apparatus includes a nozzle portion having a length corresponding to a width of a printing medium, a dot counting unit to group head nozzles by position and to count a discharged dot count per line for each group, a control unit to determine whether the group has been used to print using the discharged dot count per line, a counter to count a number of times that the group is used to print based on the determination result, and a memory to store a sum of the counted numbers of times, in which the control unit controls the counter to count the number of times that the group is used to print with respect to each line of image data when the image data is created by a head chip, and a sum of the counted number of times is stored in the memory.

Method and apparatus of dot counting in an image forming apparatus

An inkjet printhead and a method of manufacturing the same are provided. The inkjet printhead includes a substrate; a plurality of heaters formed on an upper portion of the substrate for heating ink for generating bubbles; a plurality of metal-oxide semiconductor (MOS) field effect transistors (FETs) formed on the substrate for addressing the heaters and applying electric current to the heaters; first, second, and third interconnecting layers that are sequentially formed on the MOS FETs and electrically connected to each other for applying signals to the MOS FETs; a chamber layer for defining an ink chamber, which is filled with ink for ejection, on an upper portion of the heaters; and a nozzle layer having a nozzle, through which the ink is ejected, on an upper portion of the chamber layer.

Inkjet printhead and method of manufacturing the same

An inkjet print head chip usable in an inkjet print head includes a semiconductor substrate having plural switching devices formed therein, plural heaters provided on upper sides of the switching devices and activated by the plural switching devices to heat ink, and metal wiring layers formed between the plural heaters and the switching devices which externally radiate some of the heat generated from the plural heaters.

Inkjet print head chip and inkjet print head using same

An ink-jet print head and a method of making the same comprising the steps of sequentially laminating a heating layer and an electric conductive layer on a substrate, patterning the electric conductive layer to expose a predetermined area of the top surface of the heating layer, forming a protective layer on the top surfaces of the electric conductive layer and exposed heating layer, and laminating an ink chamber barrier and a nozzle plate on the top surface of the protective layer, thereby forming an ink chamber. The protective layer is provided by forming a cavitation layer by alternately laminating at least two types of thin film layers of different materials over the exposed heating layer and the electric conductive layer to resist fractures and oxidization resulting from use.

Growing community of inventors

Seoul, South Korea

O-hyun Beak