E.i. Dupont De Nemours and Company

E. I. Du Pont De Nemours

Nyrissa S Rogado

Munirpallam Appadorai Subramanian

Brian C Auman

John Donald Summers

Thomas Eugene Dueber

Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250&#xb0; C., a water absorption factor of less than 2%, and a positive solubility measurement.

Composition of polyimide and sterically-hindered hydrophobic epoxy

Provided are compositions containing 20 to 50% by volume of a nitride or carbide of a group IV metal, a polymer, and 1 to 9% by volume of an allotrope of carbon. The compositions are useful in manufacturing resistors with low temperature coefficients of resistivity.

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Wilmington, DE, United States of America

Nyrissa S Rogado