International Business Machines Corporation

Nunzio DiPaolo

Giulio DiGiacomo

Armando S Cammarano

Daniel J Ferguson

Ananda H Kumar

Balaram Ghosal

Kim H Ruffing

George Czornyj

Rao R Tummala

Richard A Bates

Lovell B Wiggins

Heinz O Steimel

Nanik Bakhru

Suryanarayana Mukkavilli

This invention relates generally to a process and apparatus for contamination-free processing of semiconductor parts. More specifically, this invention relates to a process and apparatus for contamination-free processing of semiconductor parts in an oven or a furnace. This invention also relates to a process and apparatus for contamination-free processing of semiconductor parts in a furnace, such as a belt type furnace that sequentially stops the belt at the vicinity of at least one heating or cooling unit to heat or cool the part.

Process and apparatus for contamination-free processing of semiconductor

An apparatus for contamination-free treating semiconductor parts in a furnace. A carrier into which the semiconductor parts are placed has a cover placed over the carrier to form a boat enveloping the parts while the parts are treated in a furnace. The boat preserves an environment less contaminated than the furnace interior, and may have heating elements embedded in the carrier or cover.

A member having a shank is selectively coated with a material such as a metal by loosely sliding a washer made of a material such as a thermoplastic or thermosetting polymer onto the shank, securing the washer such that the washer is in intimate contact with the shank, and immersing at least a portion of the member into at least one coating bath so that a portion of the member is coated and the portion of the shank in contact with the washer is not coated. The member can be an input/output pin for an electronic device and the coating can be applied by methods such as electroless plating or electrolytic plating.

Selectively coated member having a shank with a portion masked

This invention relates generally to structure and method for corrosion- and stress-resistant interconnecting metallurgy, and more specifically to new structures and methods for corrosion- and stress-resistant interconnecting multilayer metallurgical pad comprising sequentially deposited layers of chromium, nickel and noble or relatively noble metal as the interconnecting metallurgy, or multilayer metallurgical pad comprising sequentially deposited layers of chromium, soluble noble metal, nickel and noble or relatively noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.

Structure and method for corrosion and stress-resistant interconnecting

Method for selectively coating a member having a shank by masking a

A method for promoting adhesion of cofired copper-based metallurgy and glass ceramic dielectric materials. The method includes the step of adding powder of an alloying metal to the copper based metallurgy prior to firing. A paste which exhibits superior adhesion to glass ceramics includes an organic carrier, copper powder, and an alloying metal, which may be a non-copper metal powder or a copper-metal alloy. It is preferred that of the metal in the paste, the copper should make up 80-99 weight percent and the alloying metal should make up 1-20 weight percent.

Method for fabricating superconductor packages

Disclosed is a ceramic substrate having a protective coating on at least one surface thereof which includes:

Ceramic substrate having a protective coating thereon and a method for

A ternary-alloy/glass composite suitable for use in vias in glass-ceramic electronic structures includes gold, palladium, and either platinum or silver in the alloy where the gold is less than 50% by weight of the alloy. The alloy is combined with glass frit where the glass is present as 5-50% by volume in the composition. The ternary-alloy glass composite is sintered in the glass-ceramic structure and provides a hermetic seal. Chips and pins can be bonded directly to the ternary-alloy/glass composite using a eutectic braze without causing cracks in the glass-ceramic. The ternary-alloy/glass composite has good adhesion with glass-ceramics and is useful in vias in electronic structures.

Growing community of inventors

Poughkeepsie, NY, United States of America

Nunzio DiPaolo