Advanced Photonics, Inc.

Union Tool Company

Nozomu Sato

Xueliang Song

Shoichi Takahashi

Yohko Makino

Genta Kanno

A pair of optical components is used in an isolator that enables electric isolation. Each of the optical components includes: first lens portions arranged on different optical paths and transmitting light in a first direction; second lens portions arranged on different optical paths and transmitting light in the second direction orthogonal to the first direction; and a reflection portion reflecting, in the second direction, the light in the first direction transmitted through the first lens portion and guiding the light to the second lens portion, or reflecting, in the first direction, the light in the second direction transmitted through the second lens portion and guiding the light to the first lens portion The second lens portion included in one of the pair of optical components and the second lens portion included in the other optical component are spaced apart from each other and face each other.

Optical component and isolator

Provided is a rotary milling tool capable of finishing a milled surface to produce a smooth and glossy surface. A rotary milling tool in which a plurality of chip discharge grooves () are provided to the outer periphery of a tip part of a tool body (), the plurality of chip discharge grooves () extending from the tool tip toward the tool base, and bottom blades () are provided to an intersection ridge part at the intersection of a rake surface () of the chip discharge grooves () and a tip flank surface () of the tool body (), each of the bottom blades () being formed integrally with the tool body (), wherein a convex edge () that is convex toward a tool-axis-direction tip is formed on at least one of the bottom blades (), and the convex edge () is formed by the connection of a plurality of linear edges that are substantially linear.

Rotary milling tool

The present invention provides a submount which includes a semiconductor element and which can be easily connected to an IC on a main substrate. The submount in one embodiment of the present invention includes: a substrate; electrodes; the semiconductor element; Au wires; and gold bumps. The electrodes, the semiconductor element, the Au wires, and the gold bumps, are encapsulated on the substrate by a resin. The gold bumps are formed on the electrodes and the Au wires by ball bonding and are cut by dicing such that side surfaces of the gold bumps are exposed. The exposed surfaces function as side surface electrodes of the submount.

Growing community of inventors

Tokyo, Japan

Nozomu Sato