Nec Corporation

Lenovo Innovations Limited (hong Kong)

Jfe Steel Corporation

Lenovo Innovations Limited

Nozomu Nishimura

Nobuhiro Mikami

Shinji Watanabe

Junya Sato

Atsumasa Sawada

Tatsuya Yamaguchi

Toru Taura

Tomohiko Ito

Hiroyuki Shimamoto

A blast furnace fault determination apparatus includes a processor configured to: calculate a fault index indicative of a degree of fault in a blast furnace; calculate a ventilation index of the blast furnace; and determine a fault condition in the blast furnace using the fault index and the ventilation index.

Blast furnace fault determination apparatus, method for determining fault in blast furnace, and method for operating blast furnace

A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other.

Component built-in module, electronic device including same, and method for manufacturing component built-in module

A component built-in module of the present invention includes: a flexible substrate that includes a first surface and a second surface on an opposite side of the first surface, the first surface including a concave part recessed in a direction from the first surface toward the second surface; a plurality of electronic components that are mounted on the first surface, mounting heights of the electronic components from the first surface to respective upper surfaces of the electronic components differing from each other; and a resin that seals the first surface. Among the plurality of electronic components, at least an electronic component having a highest mounting height is mounted in the concave part.

A circuit board device includes: plurality of wiring boards (and) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member () arranged between wiring boards (and) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block () composed of a metal material and arranged between the wiring boards (and) to enclose anisotropic conductive member (), and a pair of holding blocks (and) composed of a metal material arranged to clamp the plurality of wiring boards (and), wherein the plurality of wiring boards (and), while in a state of being clamped between the pair of holding blocks (and), is connected together by the anisotropic conductive member () and the terminals provided on each of the wiring boards (and), the functional block (), and the holding blocks (and) are electrically connected.

Circuit board device, wiring board interconnection method, and circuit board module device

A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards-, anisotropically conductive membersplaced between the individual wiring boards, functional blocksseparate from anisotropically conductive membersand are placed on the same plane as anisotropically conductive membersso as to enclose anisotropically conductive members, and a pair of holding blocksplaced to sandwich wiring boards-. These wiring boards-are kept compressed while they are clamped between pair of holding blocks, so that they are electrically connected with each other by anisotropically conductive members

Growing community of inventors

Tokyo, Japan

Nozomu Nishimura