Canon Kabushiki Kaisha

Nozomu Hayashi

Takamitsu Komaki

Yukihiro Yokota

Hiroshi Tanaka

Yasuyuki Unno

Toshiki Iwai

Yoshiyuki Usui

An imprint apparatus that forms a pattern of an imprint material on a plurality of shot regions in a substrate by using a mold, the imprint apparatus comprising: a discharger configured to discharge the imprint material onto the plurality of shot regions in the substrate; a viscosity adjuster configured to adjust a viscosity of the imprint material discharged from the discharger; and a controller configured to form the pattern of the imprint material in the plurality of shot regions, by repeatedly bringing the imprint material into contact with the mold in a state where a viscosity of at least a portion of the imprint material discharged onto the plurality of shot regions is adjusted by the viscosity adjuster, and curing of the imprint material, for each of the plurality of shot regions.

Imprint apparatus, imprint method, and method of manufacturing article

An imprint apparatus that forms a pattern by imprinting an imprint material on a substrate using an original, includes: an original support unit; a substrate support unit; a driving unit relatively driving the original support unit and the substrate support unit; a detection unit detecting a first alignment mark of the original and a second alignment mark of the substrate; a position adjustment unit adjusting a relative position between the original and the detection unit; and a control unit controlling the position adjustment unit to adjust a relative position between the original and the detection unit based on a position of the first alignment mark detected by the detection unit in a field of view of the detection unit during imprinting, and perform an alignment between the substrate and the original by the driving unit based on the first and second alignment marks detected by the detection unit.

Imprint apparatus, method of imprinting, and method of manufacturing article

A imprint method includes contacting the pattern formed on the mold M with the imprint material R supplied to a shot on the substrate W; and detecting a plurality of alignment marks AMM and AMW in the contacting while changing a position of a detector for detecting the plurality of alignment marks AMM and AMW formed on the shot on the substrate W in accordance with a progress of filling of the imprint material R into the pattern formed on the mold M.

Imprint method, imprint apparatus, and article manufacturing method using the same

A detection device includes an illumination optical system and a detection optical system. The illumination optical system is configured to illuminate a first diffraction grating having a first period in a first direction and a second diffraction grating having a second period different from the first period. The detection optical system is configured to detect light diffracted by the first and second diffraction gratings. The illumination optical system includes an optical member configured to form, on a pupil plane, a first pole and a second pole opposite to the first pole. The illumination optical system causes lights from the first and second poles to obliquely enter the first and second diffraction gratings from the first direction to illuminate the first and second diffraction gratings. The detection optical system detects diffracted light diffracted by one of the first and second diffraction gratings and by an other diffraction grating.

Detection device, imprint apparatus, planarization device, detection method, and article manufacturing method

An imprint apparatus for forming a pattern on an imprinting material includes an alignment unit that detects a mold-side mark formed on a mold and a substrate-side mark formed on the substrate, forming a mark pair, and aligns the mold and the substrate on the basis of a detection result. The alignment unit obtains, by using the detection result of a first mark pair and the detection result of a second mark pair, which is different from the first mark pair, positional deviation information of the first mark pair and positional deviation information of the second mark pair in the same direction; obtains a determination value by using the positional deviation information of the first mark pair and the positional deviation information of second mark pair; and determines that mark detection is abnormal when the determination value is not in an allowable range.

Imprint apparatus and article manufacturing method

The imprint method includes changing the position of a detector that detects an alignment mark formed on a shot on a substrate; bringing a pattern formed on a mold into contact with an imprint material supplied on the shot on the substrate; and detecting the alignment mark using the detector after completion of the change in the position of the detector. Here, the contacting is started prior to completion of the change in the position of the detector.

Imprint method, imprint apparatus, and article manufacturing method

The present invention provides an imprint apparatus which performs an imprint process in which an imprint material on a substrate is molded with a mold to form a pattern on the substrate, the apparatus including a controller configured to control the imprint process to form a predetermined layer on the substrate with a target layer, which is formed on the substrate, used as an alignment reference, wherein the controller is configured to select a mold from a plurality of molds prepared for the predetermined layer, such that an overlay error between the target layer and the predetermined layer falls within a tolerance.

Imprint apparatus, and method of manufacturing article

An exposure method comprises: a first detection step of detecting a position of a first mark by a first scope; a second detection step of detecting a position of a second mark by a second scope having a magnification higher than the first scope; a first calculation step of calculating a first correction value based on the detection results obtained in the first and second detection steps; a third detection step of detecting a position of a third mark by the second scope after the substrate is aligned based on the first correction value calculated in the first calculation step; a second calculation step of calculating a second correction value based on the detection results obtained in the second and third detection steps; and an exposure step of exposing the substrate after the substrate is aligned based on the second correction value calculated in the second calculation step.

Exposure method, exposure apparatus, and method of manufacturing device

An apparatus which processes a substrate including a mark to be detected for positioning the substrate, comprises an illuminator configured to illuminate the mark, the illuminator including a shutter which opens and closes an optical path thereof, an image pickup device configured to pick up an image of the mark illuminated by the illuminator, and a storage configured to store correction data for correcting an output of the image pickup device with respect to each of a plurality of illumination periods that depend on operations of the shutter. The apparatus is configured to obtain the correction data from the storage in accordance with the illumination period, and to correct the output of the image pickup device using the obtained correction data.

Apparatus and method of processing substrate containing mark and method of manufacturing device

A position detector, which detects the position of a mark formed on a substrate (W), comprises a creating unit (), a search unit (), and a correction unit (). The creating unit () creates a template used for identifying a mark to be detected (WM) based on an image including the mark (WM). The search unit () searches an image by using the template created by the creating unit (), and determines whether there is a pseudo pattern, other than the pattern of the mark (WM), whose degree of matching with the template is higher than a reference value. The correction unit () corrects the template based on the information of the pseudo pattern when it is determined that there is the pseudo pattern, and creates a corrected template whose degree of matching with the pseudo pattern is lower than the reference value.

Position detector, position detection method, exposure apparatus, and device manufacturing method

An exposure apparatus for exposing shot areas on a substrate comprises a measuring device configured to measure a position of an alignment mark in each of the shot areas on the substrate, and a controller configured to generate sample shot sets from the shot areas on the substrate, to cause the measuring device to measure the position of the alignment mark in each of the sample shot sets under each of measurement conditions, to calculate a shot arrangement based on the measured positions with respect to each of combinations of the measurement conditions and the sample shot sets, to calculate a variation of the shot arrangements calculated with respect to the sample shot sets with respect to each of the measurement conditions, and to display the variation calculated with respect to each of the measurement conditions.

Exposure apparatus and device manufacturing method

A method of detecting positions of first and second marks, at least one of the first and second marks being associated with a substrate, and exposing the substrate to a pattern. The method includes steps of sensing an image of the first and second marks, an image of the first mark and an image of the second mark having respective periodic patterns, of which periods are different from each other, and being formed in respective regions separate from each other, performing an orthogonal transform of a signal of the sensed image to obtain frequency components corresponding to the first and second marks, calculating positions of the first and second marks based on phases of respective frequency components corresponding to the first and second marks in the transformed signal, and positioning the substrate based on the calculated positions to expose the positioned substrate to a pattern.

Position detecting method and apparatus

An exposure apparatus performs a relative alignment between a reticle and a substrate, and exposes the substrate to light via a pattern formed on the reticle. The exposure apparatus includes a movable stage that carries one of the reticle and the substrate and a position measurement apparatus that measures a position of at least one of the reticle and the substrate. The position measurement apparatus includes an illumination unit configured to emit light toward a mark that indicates the position of the reticle or the substrate, a light intensity measurement unit configured to measure an intensity of the light, an imaging unit configured to capture an image of the mark, a stage position measurement unit configured to measure a position of the stage, and a signal waveform correction unit configured to correct a signal waveform output from the imaging unit based on a change in stage position and a change in illumination light intensity.

Position measurement apparatus, imaging apparatus, exposure apparatus, and Device manufacturing method

A method of measuring a position of a mark in a chamber, a pressure inside the chamber being different from a pressure outside the chamber. The method includes a first detection step of illuminating a reference mark fixedly disposed in the chamber using a first illuminator disposed inside the chamber, and detecting the reference mark using a detector disposed outside the chamber. The method also includes a second detection step of illuminating a mark, which is movable with respect to the reference mark in the chamber, using a second illuminator disposed inside the chamber, and detecting the mark using the detector. The method further includes a calculation step of calculating a position of the mark with respect to the reference mark based on detection results of the first and second detection steps.

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Utsunomiya, Japan

Nozomu Hayashi