The Welding Institute

Norman R Stockham

Peter J Oakley

Heidi M Miller

A method of bonding an electrical conductor to a contact of an integrated circuit (IC) device comprises bonding the conductor to a support member and to a contact of the IC device. The conductor is then severed to release the IC device and conductor from the support. This allows the IC device to be tested while connected to the support member and provides it with a conductor lead for connection to a carrier for use.

Bonding electrical conductors

In the bumped-tape automated bonding process for connecting leads to a semi-conductor circuit device, it is known to form the bumps on the free ends of the conductive leads of the tape by plating or etching. In the present invention, the free ends of the leads on the tape are heated by means of a laser beam to melt the ends of the leads so that surface tension forces form the liquid-phase end of each lead into a ball, constituting the bonding bump. The bumped ends of the leads of the tape are then bonded to terminals of the semiconductor device by conventional means.

Growing community of inventors

Sawston, United Kingdom

Norman R Stockham