The Perkin-Elmer Corporation

Norman L Shaver

Timothy A Ellis

Allen A Bahr

Joseph P Donahue

John W Watkins

Randall W Cuberly

David R Hill

Paul A Maseman

Dean P Stapleton

A substrate handling system and method in which an air chuck produces a film of air between the substrate and the air chuck, a magnetic chuck attracts the substrate to the air chuck, and an actuator subsystem moves the magnetic chuck closer to and away from the air chuck to alternately pick up a substrate and release the substrate.

Substrate handling system

An integrated, in-line bumping and exposure system for printing plates or other substrates having a photosensitive layer. A linear illumination source or sources are for bumping the photosensitive material with a band of illumination to consume dissolved oxygen within the photosensitive layer. A raster scan optical assembly or an illuminated and re-imaged spatial light modulator array exposes the photosensitive material with a rasterized beam or beams or an array of modulated electromagnetic radiation located downstream of the bumping illumination. A conveyance mechanism is configured to provide relative continuous motion between one or more substrates and the bands of illumination to continuously bump and pattern one portion of the plate or plates while the other portion of the plate or plates is bumped in anticipation of patterning.

Integrated, in-line bumping and exposure system

A method for separating lightweight sheets to be discarded interleaved with heavier items to be further processed. A gas such as air is delivered by nozzles and directed at slip sheets interleaved between photosensitive plates. The slip sheets are directed by the gas to a discarded slip sheet area. An apparatus for the slip sheet removal system comprising a plate handling area and a discarded slip sheet area.

Method and apparatus for a slipsheet removal system

Growing community of inventors

Tucson, AZ, United States of America

Norman L Shaver