Delco Electronics Corporation

Gm Global Technolgoy Operations, Inc.

Norman J Roth

Ronnie J Runyon

Robert J Wallace

Domenica N Hartman

A method of making an electrical interconnection is provided for electrically and physically connecting a plurality of bonding sites on an integrated circuit chip to a plurality of external electrical connections. This electrical interconnection method uses a plurality of individual electrical leads which have been formed so as to have the same degree of non-perpendicularity with respect to the rectangular shape of the integrated circuit. All of the individual leads are angled so as to rotate in the same direction around the integrated circuit. This angled lead design provides enhanced strain relief and improved performance during use since the integrated circuit is free to rotate under an applied stress, while efficiently maximizing the number of available electrical leads for bonding to the integrated circuit chip. In addition, this electrical interconnection method is suitable for use with tape automated bonding methods.

Method of making an electrical interconnection having angular lead design

An electrical interconnection is provided for electrically and physically connecting a plurality of bonding sites on an integrated circuit chip to a plurality of external electrical connections. The electrical interconnection contains a plurality of individual electrical leads which have been formed so as to have the same degree of non-perpendicularity with respect to the rectangular shape of the integrated circuit. All of the individual leads are angled so as to rotate in the same direction around the integrated circuit. This angled lead design provides enhanced strain relief and improved performance during use since the integrated circuit is free to rotate under an applied stress, while efficiently maximizing the number of available electrical leads for bonding to the integrated circuit chip. In addition, this electrical interconnection is suitable for use with tape automated bonding methods.

Electrical interconnection having angular lead design

A plurality of discrete bonding sites on an integrated circuit chip are electrically interconnected using a unique electrical interconnection lead. The interconnection lead comprises an electrically conductive strip having a first end and a second end. The strip is integrally connected at its first end to an electrically conductive tape comprising a plurality of conductive strips. The interconnection lead further comprises a plurality of bonding regions provided between the first and second ends of the conductive strip. These bonding regions provide the sites wherein the conductive strip is electrically connected to the appropriate bond site on the chip. The interconnection lead is suitable for use with tape automated bonding and flexible circuitry techniques.

Integrated circuit interconnect design

Propagation of electromagnetic interference waves is eliminated or substantially reduced by providing an electromagnetic interference shield suitable for shielding electromagnetic interference or radio frequency interference which are generated by offending components on a monolithic integrated circuit chip. The shield is disposed over the offending components of the integrated circuit and is sufficiently large to eliminate or substantially reduce the propagation of any offending interference waves. Alternatively, the shield may be disposed over a non-offending component to prevent radiated electromagnetic interference from entering the non-offending component. The shield is electrically conductive and maintained at a predetermined, primarily constant, electrical potential with respect to the underlying integrated circuit chip. The shield is integral with the electrically conductive tape used with tape automated bonding manufacturing techniques, or, in an alternative embodiment, the flexible conductive circuitry pattern used with flexible circuitry manufacturing techniques.

Integrated circuit shield

Redundant interconnection bonds are formed on an integrated circuit using an interconnection lead comprising a plurality of electrically conductive fingers separated from each other by an electrically nonconductive medium. The individual conductive fingers are attached to, and extend out from, an electrically conductive base at one end. In addition, the individual conductive fingers are connected to each other at a separate region. The improved interconnect lead is structurally durable and the resulting redundant bond exhibits improved electrical and operating characteristics. The interconnection lead is suitable for use with tape automated bonding or flexible circuitry technologies.

Interconnection lead with redundant bonding regions

An acceleration responsive sensor having a housing of molded dielectric material provided with an elongated sector shaped recess receiving a pendulum supported mass movable under an acceleration pulse into engagement with one or more fingers of a contact assembly within the recess. The mass and the contact assembly are mounted to the housing exteriorly of the recess and covered by a cover assembly of molded dielectric material.

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Kokomo, IN, United States of America

Norman J Roth