Rca Inc.

Sarnoff Corporation

Sri International

Norman Goldsmith

Peter Alan Levine

Pradyumna Kumar Swain

Mahalingam Bhaskaran

Sheng T Hsu

Paul H Robinson

A method for fabricating a back-illuminated semiconductor imaging device on a semiconductor-on-insulator substrate, and resulting imaging device is disclosed. The method for manufacturing the imaging device includes the steps of providing a substrate comprising an insulator layer, and an epitaxial layer substantially overlying the insulator layer; fabricating at least one imaging component at least partially overlying and extending into the epitaxial layer; forming a plurality of bond pads substantially overlying the epitaxial layer; fabricating a dielectric layer substantially overlying the epitaxial layer and the at least one imaging component; providing a handle wafer; forming a plurality of conductive trenches in the handle wafer; forming a plurality of conductive bumps on a first surface of the handle wafer substantially underlying the conductive trenches; and bonding the plurality of conductive bumps to the plurality of bond pads.

Method of fabricating back-illuminated imaging sensors using a bump bonding technique

A method for fabricating a back-illuminated semiconductor imaging device and resulting imaging device is disclosed, which includes the steps providing a substrate having a front surface and a back surface; growing an epitaxial layer substantially overlying the front surface of the substrate; forming at least one barrier layer substantially within the epitaxial layer; fabricating at least one imaging structure overlying and extending into the epitaxial layer, the imaging structure at least one charge transfer region, the at least one barrier layer substantially underlying the at least one charge transfer region, wherein light incident on the back surface of the substrate generates charge carriers which are diverted away from the at least one charge transfer region by the at least one barrier layer. At least a portion of the epitaxial layer is grown using an epitaxial lateral overgrowth technique. The barrier layer can be a high energy implant formed substantially within the epitaxial layer, an optical shield made of an optically opaque material surrounded by oxide on all sides, or a combination of both. The imaging structure can be a CCD or CMOS imaging structure.

Method and apparatus for reducing smear in back-illuminated imaging sensors

An improved gate injected, floating gate memory device is described having improved charge retention and endurance characteristics is described in which the barrier height for the injection of charge (electrons or holes) into the floating gate is reduced. This is accomplished by utilizing a layer of semi-insulating polycrystalline silicon between the control electrode and the insulating layer over the floating gate.

Method of forming an improved gate member for a gate injected floating

Gate injected floating gate memory device

Epitaxial layers of silicon, having thicknesses of at least about 25 .mu.m, are grown on the (100) or (111) planar surfaces of silicon substrates by the vapor deposition of silicon from the reaction of dichlorosilane and hydrogen gas in a reactor furnace. Good epitaxial layers of silicon of substantially uniform thicknesses are formed on the substrates when the growth rate of the epitaxial layer is between about 5 and 20 .mu.m/minute in the reactor furnace, and the latter is heated to a temperature of between about 1050.degree. and 1200.degree.C.

Growing community of inventors

East Brunswick, NJ, United States of America

Norman Goldsmith