Toagosei Chemical Industry, Co., Ltd.

Toagosei Company, Ltd.

Noriyuki Yamamoto

Hideki Kato

Koji Sugiura

Toshiro Hirose

Takuya Oomura

Osamu Takagi

Nobuhiko Aiba

Kenichi Ishizaki

Satoshi Yamato

Takahisa Ogasawara, Deceased

Masami Asai, Deceased

Toshio Hirukawa

Tomohisa Iinuma

Aldehyde gas absorbent and process for absorbing aldehyde gas

The present invention provides an antimicrobial agent consisting of glass which comprises 50 to 60 mole % of ZnO, 20 to 30 mole % of at least one member selected from the group consisting of B O and P O , 1 to 10 mole % of at least one member selected from the group consisting of Al O and ZrO , 5 to 10 mole % of an alkali metal oxide and 0 to 15 mole % of SiO and an antimicrobial agent consisting of glass which comprises 50 to 70 mole % of ZnO, 20 to 35 mole % of P O , 0.5 to 10 mole % of Al O , 0.5 to 10 mole % of SnO , 0 to 5 mole % of SiO and 5 to 10 mole % of an alkali metal oxide as well as an antimicrobial resin composition and antimicrobial artificial marble, each of which comprises a resin and the antimicrobial agent blended therewith. The antimicrobial resin composition and the antimicrobial artificial marble are excellent in their antimicrobial properties, resistance to color change and water resistance.

Antimicrobial agent, antimicrobial resin composition and antimicrobial artificial marble

Disclosed is a granular inorganic ion exchanger which is obtained by firing at 400.degree. C. or higher a granular molded product of a mixture of a metal alkoxide such as Si(OMe).sub.4 or hydrolyzate thereof, a clay mineral such as sepiolite and an inorganic ion exchanger such as antimony pentoxide and which has mechanical strength and heat resistance without losing its inherent ion exchangeability.

Granular inorganic exchangers

An epoxy resin composition for use in sealing semiconductors, having enhanced moisture resistance reliability is disclosed, which comprises an epoxy resin and an oxyacid bismuth oxyhydroxide represented by the following formula (1):

Epoxy resin composition for use in sealing semiconductors

A method for preventing aluminum corrosion in electronic parts which comprises adding lead hydroxy apatite and/or cadmium hydroxy apatite to constituents of the electronic parts through which halogen ions pass, so that said ions may be captured by said apatites in said constituents.

Method for preventing aluminum corrosion in electronic parts

This invention provides an insulating protective material effective for protection of electronic and electric devices such as electronics elements. This insulating protective material contains at least one hydrous oxide of a metal which has ion exchange properties together with a fusion bonding component such as low-melting glass, epoxy resin, phenolic resin, silicone resin, etc. and a filler such as fused silica, .beta.-eucryptite, glass fiber, glass beads, etc. Said specific hydrous oxide can be used together with a sulfur-containing organic high molecular weight compound. The hydrous oxides used in protective materials as a sealing material for electronic and electric devices can capture an ionic impurity eluted from the components of the protective material and fix it therein thereby to provide stable electronic materials excellent in performance.

Insulating protective material

Growing community of inventors

Aichi, Japan

Noriyuki Yamamoto