Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Noriyuki Tani

Akira Kabeshita

Shozo Minamitani

Kurayasu Hamasaki

Yoichi Makino

Yoshihiro Mimura

Noboru Furuta

Yuya Matsumoto

Shota Akaura

Masaru Kawazoe

Shigeo Masaki

Tomohiro Tsunekazu

A parking assist apparatus includes a one-way traffic determiner that determines whether or not a vehicle is located on a one-way road, and a parking processor that, when it is determined that the vehicle is located on the one-way road case, does not perform a vehicle control for parallel parking including a path through which the vehicle reverses.

Parking assist apparatus, parking assist method, and computer program

A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Component mounting apparatus

While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet, corresponding to an adhesion region of a semiconductor chip, is sucked and held, a plurality of protruding portions of a removing member are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the adhesion region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change an adhesive surface bond of the semiconductor chip to the adhesive sheet to point bonding. Further, the removing member is moved along the bottom surface of the semiconductor chip so as to change the position of the point bonding and decrease the adhesive bonding force to the adhesive sheet. Then, the semiconductor chip is removed from the adhesive sheet.

Apparatus and method for removing semiconductor chip

A mounter including at least two mounting stagesandwhere components are mounted onto boards transported from the upstream side in transportation direction of the boardand then transport the boards to the downstream side, and the mounter includes a first stopping unitfor stopping the board to place a board edge on the downstream side on a first fixed position which is in the downstream side from a first mountable area A, the first mountable area A being a mountable region where the components can be mounted on the first mounting stageon the upstream side, and a second stopping unitfor stopping the board to place a board edge on the upstream side on a second fixed position which is the upstream side from a second mountable area A, the second mountable area A being a mountable region where the components can be mounted on the second mounting stage

Board positioning method

A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Component mounting method

A mounting-waiting process for making a substrate to be transferred into a mounting process wait before the mounting process; and a substrate discharge-waiting process for making the substrate transferred from the mounting process wait before the following process are provided. When transfer of an unmounted substrate into the mounting process and transfer of a mounted substrate from the mounting process to the substrate discharge-waiting process are performed simultaneously, it is detected, by a substrate-arrival detecting sensor for detecting the mounted substrate transferred to the substrate discharge-waiting process and a substrate-continuity detecting sensor for detecting the unmounted substrate continuously transferred following to the mounted substrate, that a plurality of substrates have been transferred into the discharge-waiting process continuously.

Growing community of inventors

Kurume, Japan

Noriyuki Tani